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SMDND02680Y100JP00

产品描述Film Capacitor, Polyethylene Naphthalate, 100V, 5% +Tol, 5% -Tol, 0.068uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小300KB,共7页
制造商WIMA
官网地址https://www.wima.de/
标准
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SMDND02680Y100JP00概述

Film Capacitor, Polyethylene Naphthalate, 100V, 5% +Tol, 5% -Tol, 0.068uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT

SMDND02680Y100JP00规格参数

参数名称属性值
是否Rohs认证符合
Objectid2104972835
包装说明, 2220
Reach Compliance Codeunknown
ECCN代码EAR99
电容0.068 µF
电容器类型FILM CAPACITOR
介电材料POLYETHYLENE NAPHTHALATE
JESD-609代码e3
安装特点SURFACE MOUNT
负容差5%
端子数量2
最高工作温度100 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, BLISTER, 7 INCH
正容差5%
额定(AC)电压(URac)63 V
额定(直流)电压(URdc)100 V
尺寸代码2220
表面贴装YES
端子面层Tin (Sn)
端子形状WRAPAROUND

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WIMA SMD-PEN
Metallized Polyethylene-Naphthalate (PEN)
SMD Film Capacitors with Box Encapsulation
D
Special Features
˜
Size codes 1812, 2220, 2824,
4030, 5040 and 6054 with PEN
and encapsulated
˜
Operating temperature up to 125° C
˜
Self-healing
˜
Suitable for lead-free soldering
˜
According to RoHS 2002/95/EC
Electrical Data
Capacitance range:
0.01
mF
to 4.7
mF
Rated voltages:
63 VDC, 100 VDC, 250 VDC, 400 VDC,
630 VDC, 1000 VDC
Capacitance tolerances:
±20%, ±10% (±5% available subject
to special enquiry)
Operating temperature range:
–55+ C to +125+ C
Climatic test category:
55/125/21 according to IEC
for size codes 1812 to 2824
55/125/56 according to IEC
for size codes 4030 to 6054
Insulation resistance
at +20+ C:
U
r
U
test
C
0.33
mF
3.75 x 10
3
(mean value: 1 x 10
4
M¸)
1 x 10
4
(mean value: 5 x 10
4
M¸)
63 VDC 50 V
100 VDC 100 V
250 VDC 100 V
Test voltage:
1.6 U
r
, 2 sec.
Voltage derating:
A voltage derating factor of 1.25 % per K
must be applied from +100) C for DC
voltages and from +90) C for AC
voltages
Reliability:
Operational life
300 000 hours
Failure rate
2 fit (0.5 x U
r
and 40+ C)
Typical Applications
For general DC-applications e.g.
˜
By-pass
˜
Blocking
˜
Coupling and decoupling
˜
Timing
Construction
Dielectric:
Polyethylene-Naphthalate (PEN) film
Capacitor electrodes:
Vacuum-deposited
Internal construction:
0.33
mF
< C
4.7
mF
1250 sec (M¸ x
mF)
(mean value: 3000 sec)
3000 sec (M¸ x
mF)
(mean value: 10 000 sec)
Measuring time: 1 min.
Dissipation factors
at +20) C: tan
d
at f
C
0.1
mF
8 x 10
-3
15 x 10
-3
30 x 10
-3
0.1
mF
< C
1.0
mF
8 x 10
-3
15 x 10
-3
C > 1.0
mF
10 x 10
-3
1 kHz
10 kHz
100 kHz
Plastic film
Vacuum-deposited
electrode
Metal contact layer
(schoopage)
Terminating plate
Maximum pulse rise time:
for pulses equal to the rated voltage
Capacitance
m
F
Pulse rise time V/
m
sec
max. operation/test
100 VDC 250 VDC 400 VDC
35/350
20/200
10/100
6/60
4/40
3/30
40/400
40/400
12/120
9/90
7/70
35/350
21/210
14/140
10/100
Encapsulation:
Solvent-resistant, flame-retardant plastic
case, UL 94 V-0
Terminations:
Tinned plates.
Marking:
Box colour: Black.
63 VDC
30/300
20/200
10/100
8/80
3.5/35
3/30
630 VDC 1000 VDC
40/400
25/250
17/170
50/500
32/320
0.01
0.033
0.1
0.33
1.0
3.3
...
...
...
...
...
...
0.022
0.068
0.22
0.68
2.2
4.7
Dip Solder Test/Processing
Resistance to soldering heat:
Test Tb in accordance with DIN IEC
60068-2-58/DIN EN 60384-23.
Soldering bath temperature max. 260+ C.
Soldering duration max. 5 sec.
Change in capacitance
D
C/C
5 %.
Soldering process:
Wave soldering and re-flow soldering
(see temperature/time graphs page 14).
01.10
Packing
Available taped and reeled in 12 mm
blister pack.
Detailed taping information and graphs
at the end of the catalogue.
For further details and graphs please
refer to Technical Information.
21

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