analog to digital converters - adc 8-bit 250ksps -15v precision adc
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP18,.3 |
| 针数 | 18 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 10 V |
| 最小模拟输入电压 | -10 V |
| 最长转换时间 | 6 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDIP-T18 |
| JESD-609代码 | e3 |
| 长度 | 22.86 mm |
| 最大线性误差 (EL) | 0.3% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MAX160EPN+ | MAX160CWN+T | MAX160EWN+T | MAX160EWN+ | MX7574KN+ | MX7574KCWN+ | |
|---|---|---|---|---|---|---|
| 描述 | analog to digital converters - adc 8-bit 250ksps -15v precision adc | analog to digital converters - adc 8-bit 250ksps -15v precision adc | analog to digital converters - adc 8-bit 250ksps -15v precision adc | analog to digital converters - adc 8-bit 250ksps -15v precision adc | analog to digital converters - adc 8-bit precision dac | analog to digital converters - adc 8-bit precision dac |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | DIP | SOIC |
| 包装说明 | DIP, DIP18,.3 | SOP, SOP18,.4 | SOP, SOP18,.4 | SOP, SOP18,.4 | DIP, DIP18,.3 | SOP, SOP18,.4 |
| 针数 | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
| 最小模拟输入电压 | -10 V | -10 V | -10 V | -10 V | -10 V | -10 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDIP-T18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 22.86 mm | 11.55 mm | 11.55 mm | 11.55 mm | 22.86 mm | 11.55 mm |
| 最大线性误差 (EL) | 0.3% | 0.3% | 0.3% | 0.3% | 0.2% | 0.2% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 | 18 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 输出位码 | BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | DIP | SOP |
| 封装等效代码 | DIP18,.3 | SOP18,.4 | SOP18,.4 | SOP18,.4 | DIP18,.3 | SOP18,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 2.65 mm | 2.65 mm | 2.65 mm | 4.572 mm | 2.65 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.62 mm | 7.5 mm |
| 最长转换时间 | 6 µs | 6 µs | 6 µs | 6 µs | - | - |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| Factory Lead Time | - | - | 5 weeks | 6 weeks | 11 weeks | 6 weeks |
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