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89HPES12NT3ZBBCG8

产品描述CABGA-324, Reel
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小831KB,共30页
制造商IDT (Integrated Device Technology)
标准
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89HPES12NT3ZBBCG8概述

CABGA-324, Reel

89HPES12NT3ZBBCG8规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码CABGA
包装说明CABGA-324
针数324
制造商包装代码BCG324
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys DescriptionCHIP ARRAY BGA 19X19MM X 1.00MM PITCH
地址总线宽度
总线兼容性PCI; SMBUS
最大时钟频率125 MHz
最大数据传输速率6000 MBps
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e1
长度19 mm
湿度敏感等级3
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)260
电源1,3.3 V
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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12-lane 3-Port Non-Transparent
PCI Express® Switch
®
89HPES12NT3
Data Sheet
Device Overview
The 89HPES12NT3 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions offering the next-generation I/O inter-
connect standard. The PES12NT3 is a 12-lane, 3-port peripheral chip
that performs PCI Express Base switching with a feature set optimized
for high performance applications such as servers, storage, and commu-
nications/networking. It provides high-performance I/O connectivity and
switching functions between a PCIe® upstream port, a transparent
downstream port, and a non-transparent downstream port.
With non-transparent bridging (NTB) functionality, the PES12NT3
can be used standalone or as a chipset with IDT PCIe System Intercon-
nect Switches in multi-host and intelligent I/O applications such as
communications, storage, and blade servers where inter-domain
communication is required.
Features
High Performance PCI Express Switch
Twelve PCI Express lanes (2.5Gbps), three switch ports
Delivers 48 Gbps (6 GBps) of aggregate switching capacity
Low latency cut-through switch architecture
Support for Max Payload size up to 2048 bytes
Supports one virtual channel and eight traffic classes
PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
Port arbitration schemes utilizing round robin
Supports automatic per port link width negotiation (x4, x2, or
x1)
Static lane reversal on all ports
Automatic polarity inversion on all lanes
Supports locked transactions, allowing use with legacy soft-
ware
Ability to load device configuration from serial EEPROM
Ability to control device via SMBus
Non-Transparent Port
Crosslink support on NTB port
Four mapping windows supported
Each may be configured as a 32-bit memory or I/O window
May be paired to form a 64-bit memory window
Interprocessor communication
Thirty-two inbound and outbound doorbells
Four inbound and outbound message registers
Two shared scratchpad registers
Allows up to sixteen masters to communicate through the non-
transparent port
No limit on the number of supported outstanding transactions
through the non-transparent bridge
Completely symmetric non-transparent bridge operation
allows similar/same configuration software to be run
Supports direct connection to a transparent or non-transparent
port of another switch
Block Diagram
3-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Non-
Transparent
Bridge
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
12 PCI Express Lanes
x4 Upstream Port and Two x4 Downstream Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
Inc.
1 of 29
February 19, 2009
DSC 6929

89HPES12NT3ZBBCG8相似产品对比

89HPES12NT3ZBBCG8 89HPES12NT3ZBBCI 89HPES12NT3ZBBCGI 89HPES12NT3ZBBC8
描述 CABGA-324, Reel CABGA-324, Tray CABGA-324, Tray CABGA-324, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 含铅 不含铅 含铅
是否Rohs认证 符合 不符合 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 CABGA CABGA CABGA CABGA
包装说明 CABGA-324 CABGA-324 CABGA-324 CABGA-324
针数 324 324 324 324
制造商包装代码 BCG324 BC324 BCG324 BC324
Reach Compliance Code compliant not_compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
总线兼容性 PCI; SMBUS PCI PCI PCI; SMBUS
最大时钟频率 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e1 e0 e1 e0
长度 19 mm 19 mm 19 mm 19 mm
湿度敏感等级 3 3 3 3
端子数量 324 324 324 324
最高工作温度 70 °C 85 °C 85 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA LBGA LBGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度) 260 225 260 225
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.5 mm 1.5 mm 1.5 mm 1.5 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED 20 30 NOT SPECIFIED
宽度 19 mm 19 mm 19 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1

 
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