REVISIONS
LTR
A
DESCRIPTION
Updated boilerplate. Added device type 03 to drawing. Changed t
APW
minimum
limits from 75ns and 100 ns to the quantity t
RP
+ t
CK
. Removed all references to
n
BSD
from drawing. - glg
Changes in accordance with NOR 5962-R071-98. - glg
Changes to paragraph 1.3 and 1.4. Table IA changes to I
L
, I
O
, I
CC2N
, I
CC3P
,
I
CC3PS
, I
CC3N
, I
CC4
, and I
CC5
. Removed number of cycles table from Table IA,
sheet 12. - glg
Change CAGE code to correct CAGE of 67268. Update to current boilerplate.
Editorial changes throughout. - gap
DATE (YR-MO-DA)
98-01-20
APPROVED
Raymond Monnin
B
C
98-03-19
99-03-16
Raymond Monnin
Raymond Monnin
D
02-04-02
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
35
D
15
D
36
D
16
D
37
D
17
D
38
D
18
REV
D
39
D
19
D
40
D
20
D
41
D
21
D
1
D
42
D
22
D
2
D
43
D
23
D
3
D
44
D
24
D
4
D
45
D
25
D
5
D
46
D
26
D
6
D
47
D
27
D
7
D
48
D
28
D
8
D
49
D
29
D
9
D
50
D
30
D
10
D
31
D
11
D
32
D
12
D
33
D
13
D
34
D
14
SHEET
PREPARED BY
Gary L. Gross
CHECKED BY
Jeff Bowling
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY All DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Raymond Monnin
DRAWING APPROVAL DATE
97-06-17
REVISION LEVEL
D
MICROCIRCUIT, MEMORY, DIGITAL, CMOS,
512K x 16-BIT x 2-BANK, SYNCHRONOUS
DYNAMIC RANDOM ACCESS MEMORY (SDRAM),
MONOLITHIC SILICON
SIZE
A
SHEET
1 OF
50
5962-E310-02
CAGE CODE
67268
5962-97545
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V),
high reliability (device classes M and Q), and nontraditional performance environment (device class N). A choice of case
outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of
Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class N, the user is cautioned to assure that
the device is appropriate for the application environment.
1.2 PIN. The PIN is as shown in the following example:
5962
|
|
|
Federal
stock class
designator
\
-
|
|
|
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
626162-15
626162-20
626162-12
Circuit function
512K word x 16 bit x 2 bank, synchronous DRAM
512K word x 16 bit x 2 bank, synchronous DRAM
512K word x 16 bit x 2 bank, synchronous DRAM
Access time
15 ns
20 ns
12 ns
97545
01
|
|
|
Device
type
(see 1.2.2)
/
Q
|
|
|
Device
class
designator
(see 1.2.3)
X
|
|
|
Case
outline
(see 1.2.4)
X
|
|
|
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535 with a nontraditional
performance environment (encapsulated in plastic)
Certification and qualification to MIL-PRF-38535
N
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
See figure 1
See figure 1
Terminals
50
50
Package style
Ceramic dual flat pack
Plastic TSOP(II) package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
5962-97545
SHEET
D
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/ 2/
Supply voltage range, (V
CC
) ..................................................................................
Supply voltage range for output drivers, (V
CCQ
) ....................................................
Voltage range on any input pin .............................................................................
Voltage range on any output pin ..........................................................................
Short-circuit output current ...................................................................................
Power dissipation .................................................................................................
Operating free-air temperature range, (T
A
) ...........................................................
Storage temperature range, (T
stg
) .........................................................................
Junction temperature, (T
J
) ....................................................................................
Thermal resistance, junction-to-case, (θ
JC
):
Case X ..............................................................................................................
Case Y ..............................................................................................................
1.4 Recommended operating conditions. 2/
Supply voltage range, (V
CC
) ..................................................................................
Supply voltage for output drivers, (V
CCQ
) ..............................................................
Supply voltage, (V
SS
) ............................................................................................
Supply voltage for output drivers, (V
SSQ)
...............................................................
High-level input voltage, (V
IH
) ...............................................................................
Low-level input voltage, (V
IL
) ................................................................................
Operating free-air temperature, (T
A
) .....................................................................
1.5 Digital logic testing for device classes N, Q, and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) .........................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
100 percent
+3.135 V dc to +3.465 V dc
+3.135 V dc to +3.465 V dc 3/
0 V dc
0 V dc
+2.0 V dc to V
CC
+0.3 V dc
-0.3 V dc to +0.8 V dc
-55°C to +125°C
-0.5 V dc to +4.6 V dc
-0.5 V dc to +4.6 V dc
-0.5 V dc to +4.6 V dc
-0.5 V dc to V
CC
+0.5 V dc
50 mA
1W
-55°C to +125°C
-65°C to +150°C
+175°C
+5°C/W
+1°C/W
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ All voltage values in this drawing are with respect to V
SS
.
3/ V
CCQ
≤
V
CC
+0.3 V.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
5962-97545
SHEET
D
3
DSCC FORM 2234
APR 97
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes N, Q, and V shall be in accordance with MIL-
PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes N, Q, and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth tables. The truth tables shall be as specified on figure 3.
3.2.4 Output load circuit. The output load circuit shall be as specified on figure 4.
3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 5.
3.2.6 Functional tests. Various functional tests used to test this device are contained in the appendix. If the test patterns
cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be
allowed. For device class M, alternate test patterns shall be maintained under document revision level control by the
manufacturer and shall be made available to the preparing or aquiring activity upon request. For device class Q and V,
alternate test patterns shall be under the control of the device manufacturer’s Technology Review Board (TRB) in accordance
with MIL-PRF-38535 and shall be made available to the preparing or aquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes N, Q, and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
5962-97545
SHEET
D
4
DSCC FORM 2234
APR 97
3.5.1 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a "QML" or "Q" as
required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix
A.
3.6 Certificate of compliance. For device classes N, Q, and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a
certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-
HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes N, Q, and V, the requirements of
MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes N, Q, and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 41 (see MIL-PRF-38535, appendix A).
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes N, Q, and V, sampling and inspection procedures shall be in accordance
with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall
be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes N, Q, and V, screening shall be in accordance with MIL-PRF-38535, and shall be
conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be
in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance
inspection.
4.2.1 Additional criteria for device class M.
a.
b.
Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in)
electrical parameters of method 5004 and substitute lines 1 through 6 of table II herein.
The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases,
and power dissipation, as applicable, in accordance with the intent specified in test method 1015.
(1) Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
c.
Interim and final electrical parameters shall be as specified in table II herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
5962-97545
SHEET
D
5
DSCC FORM 2234
APR 97
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