XBP06V4E2HR-G
Transient Voltage Suppressor (TVS)
ETR2902-004
■GENERAL
DESCRIPTION
Two elements in USP-3 package (Anode Common)
High ESD
■APPLICATIONS
ESD protection
■ABSOLUTE
MAXIMUM RATINGS
Ta=25℃
PARAMETER
Peak Pulse Power
(*1)
Power Dissipation
Junction Temperature
Storage Temperature Range
ESD Durability
(*3)(*4)
Contact Discharge
SYMBOL
Ppk
Pd
Tj
Tstg
Vpp
RATINGS
70
120
1000
(*2)
150
-55½+150
30
UNITS
W
mW
℃
℃
kV
■PACKAGING
INFORMATION
(*1): tp=8/20μs
(*2): This is a reference data taken by using the test board.
(*3): Test Condition IEC61000-4-2 Standard
(*4): Criterion： No damage to device elements
■MARKING
RULE
① ② ③
④ ⑤
①②③：BP1(Product
Number)
④⑤：Lot
Number
■PIN
CONFIGURATION
1
2
1.
2.
3.
3
3
Cathode
Cathode
Anode
■PRODUCT
NAME
PRODUCT NAME
XBP06V4E2HR-G
*
PACKAGE
USP-3
ORDER UNIT
3,000/Reel
BOTTOM VIEW
*
The “-G” suffix indicates that the products are Halogen and Antimony free
as well as being fully RoHS compliant.
■
ELECTRICAL CHARACTERISTICS
PARAMETER
Breakdown Voltage
Leakage Current
Forward Voltage
Inter-Terminal Capacity
SYMBOL
V
BR
I
RM
V
F
C
t
I
R
=5mA
V
RM
=5V
I
F
=10mA
V
R
=0V, f=1MHz
TEST CONDITION
MIN.
6.4
-
-
-
LIMITS
TYP.
6.8
-
-
40
MAX.
7.2
1.0
1.25
-
Ta=25℃
UNITS
V
μA
V
pF
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XBP06V4E2HR-G
■TYPICAL
PERFORMANCE CHARACTERISTICS
(1) Reverse Current vs. Breakdown Voltage
(2) Reverse Current vs. Reverse Voltage
100
1
Reverse Current I
R
(mA)
Reverse Current I
R
(uA)
10
75℃
0.1
Ta=125℃
75℃
25℃
1
25℃
Ta=125℃
-25℃
0.01
-25℃
0.1
0.01
0.001
0.001
5.0
5.5
6.0
6.5
7.0
7.5
8.0
0.0001
0
1
2
3
4
5
6
Breakdown Voltage V
BR
(V)
(3) Breakdown Voltage vs. Operating Temperature
Reverse Voltage V
R
(V)
(4) Reverse Current vs. Operating Temperature
8.0
7.5
10
Breakdown Voltage V
BR
(V)
Reverse Current I
R
(uA)
7.0
6.5
6.0
5.5
5.0
-50
0
50
100
I
R
=5mA
1
0.1
V
R
=5.25V
5V
0.01
3V
150
0.001
-50
0
50
100
150
Operating Temperature Ta (℃)
(5) Inter-Terminal Capacity vs. Reverse Voltage
Operating Temperature Ta (℃)
(6) Forward Current vs. Forward Voltage
100
Inter-Terminal Capacity Ct (pF)
90
80
70
60
50
40
30
20
10
0
0
1
2
3
4
f=1MHz
Forward Current I
F
(mA)
100
10
Ta=125℃
1
75℃
25℃
-25℃
Ta=25℃
0.1
0.01
5
6
0
0.2
0.4
0.6
0.8
1
1.2
Reverse Voltage V
R
(V)
Forward Voltage V
F
(V)
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XBP06V4E2HR-G
■PACKAGING
INFORMATION
●
USP-3 Power Dissipation
Power dissipation data for the USP-3 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Condition:
Ambient:
Soldering:
Board:
Mount on a board
Natural convection
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm in one side)
Copper (Cu) traces occupy 50% of the board area
in top and back faces.
Package heat-sink is tied to the copper traces.
Material:
Thickness:
Through-hole:
Glass Epoxy (FR-4)
1.6 mm
4 x 0.8 Diameter
2
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 150℃)
Ambient Temperature (℃)
25
150
Power Dissipation Pd (mW)
1000
0
Thermal Resistance (℃/W)
125.00
Pd-Ta特性グラフ
Pd vs. Ta
Power Dissipation: Pd (mW)
許容損失Pd（mW）
1200
1000
800
600
400
200
0
25
50
75
100
Ambient Temperature: Ta (℃)
周囲温度Ta（℃）
125
150
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XBP06V4E2HR-G
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
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