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256-301750-18

产品描述IC Socket, BGA256, 256 Contact(s)
产品类别连接器    插座   
文件大小170KB,共1页
制造商Aries Electronics
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256-301750-18概述

IC Socket, BGA256, 256 Contact(s)

256-301750-18规格参数

参数名称属性值
Reach Compliance Codecompli
ECCN代码EAR99
其他特性BGA ADAPTER
联系完成配合NOT SPECIFIED
设备插槽类型IC SOCKET
使用的设备类型BGA256
制造商序列号301750
触点数256
Base Number Matches1

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256-301750-18
16x16 Array (256) Ball BGA Adapter
Converts from 0.8mm Pitch to 1.00mm Pitch
FEATURES:
• Correct-A-Chip™ technology solves problems associat-
ed with the use of alternate ICs (due to availability,
obsolescence, need for better performance, etc.) by
eliminating the need for new PCBs.
• Alows .8mm Pitch devices to be mounted to PCBs laid
out for 1.00mm Pitch devices.
GENERAL SPECIFICATIONS:
• PCB is FR-4, .040.
• Solder Ball is .020” dia Sn/Pb 63/37.
• PCB plating is ENIG (Immersion Gold over Electroless
Nickel) 3-8μ Gold per IPC-4552 over 100μ min. Nickel
per ASTM-B-733.
• Solder mask is black LPI (liquid photo imagable).
• Operation Temperature is 221°F [105°C] continuous.
MOUNTING CONSIDERATIONS:
• Suggested PCB Pad size = .025 ± .002 [.635] dia.
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
Note: Aries specializes in custom design and production. In addition to the standard
products shown on this page, special materials, platings, sizes, and configurations
can be furnished, depending on quantities. Aries reserves the right to change prod-
uct specifications without notice.
All tolerances ± .010 [.25]
unless otherwise specified
http://www.arieselec.com • info@arieselec.com
Frenchtown, NJ USA
TEL: (908) 996-6841
FAX: (908) 996-3891
abc
18105
Rev A
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED

 
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