buffers & line drivers 3-state buffer
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconduc |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSOP |
| 包装说明 | PLASTIC, SOT-753, SC-74A, 5 PIN |
| 针数 | 5 |
| 制造商包装代码 | SOT753 |
| Reach Compliance Code | compli |
| 控制类型 | ENABLE HIGH |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e3 |
| 长度 | 2.9 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 5 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 6 ns |
| 传播延迟(tpd) | 10.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 1.5 mm |

| 74LVC1G126GV,125 | 74LVC1G126GM,132 | 74LVC1G126GW,125 | 74LVC1G126GF,132 | 74LVC1G126GS,132 | |
|---|---|---|---|---|---|
| 描述 | buffers & line drivers 3-state buffer | buffers & line drivers bus buf/line 3-state | buffers & line drivers 3.3V picogate bus | buffers & line drivers 3.3V buf/LD activ HI | translation - voltage levels 10.5ns 5.5V 250mw |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | PLASTIC, SOT-753, SC-74A, 5 PIN | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 | 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 | VSON, SOLCC6,.04,14 |
| 制造商包装代码 | SOT753 | SOT886 | SOT353-1 | SOT891 | SOT1202 |
| Reach Compliance Code | compli | compli | compli | compli | compli |
| 控制类型 | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-N6 | R-PDSO-G5 | R-PDSO-N6 | S-PDSO-N6 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 2.9 mm | 1.45 mm | 2.05 mm | 1 mm | 1 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS TRANSCEIVER |
| 最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 5 | 6 | 5 | 6 | 6 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | VSON | TSSOP | VSON | VSON |
| 封装等效代码 | TSOP5/6,.11,37 | SOLCC6,.04,20 | TSSOP5/6,.08 | SOLCC6,.04,14 | SOLCC6,.04,14 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns |
| 传播延迟(tpd) | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 0.5 mm | 1.1 mm | 0.5 mm | 0.35 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 1.8 V | 1.8 V | 1.8 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | GULL WING | NO LEAD | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 0.95 mm | 0.5 mm | 0.65 mm | 0.35 mm | 0.35 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | NOT SPECIFIED |
| 宽度 | 1.5 mm | 1 mm | 1.25 mm | 1 mm | 1 mm |
| 零件包装代码 | TSOP | SON | TSSOP | SON | - |
| 针数 | 5 | 6 | 5 | 6 | - |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - |
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