CY7C1316CV18, CY7C1916CV18
CY7C1318CV18, CY7C1320CV18
18-Mbit DDR-II SRAM 2-Word
Burst Architecture
Features
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Functional Description
The CY7C1316CV18, CY7C1916CV18, CY7C1318CV18, and
CY7C1320CV18 are 1.8V Synchronous Pipelined SRAMs
equipped with DDR-II architecture. The DDR-II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a one-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with two 8-bit words in the case of CY7C1316CV18
and two 9-bit words in the case of CY7C1916CV18 that burst
sequentially into or out of the device. The burst counter always
starts with a ‘0’ internally in the case of CY7C1316CV18 and
CY7C1916CV18. For CY7C1318CV18 and CY7C1320CV18,
the burst counter takes in the least significant bit of the external
address and bursts two 18-bit words (in the case of
CY7C1318CV18) of two 36-bit words (in the case of
CY7C1320CV18) sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs, D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need to capture data
separately from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)
267 MHz clock for high bandwidth
2-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces
(data transferred at 534 MHz) at 267 MHz
Two input clocks (K and K) for precise DDR timing
❐
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Synchronous internally self-timed writes
DDR-II operates with 1.5 cycle read latency when the DLL is
enabled
Operates similar to a DDR-I device with 1 cycle read latency in
DLL off mode
1.8V core power supply with HSTL inputs and outputs
Variable drive HSTL output buffers
Expanded HSTL output voltage (1.4V–V
DD
)
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
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Configurations
CY7C1316CV18 – 2M x 8
CY7C1916CV18 – 2M x 9
CY7C1318CV18 – 1M x 18
CY7C1320CV18 – 512K x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
x8
x9
x18
x36
267 MHz
267
775
780
805
855
250 MHz
250
705
710
730
775
200 MHz
200
575
580
600
635
167 MHz
167
490
490
510
540
Unit
MHz
mA
Cypress Semiconductor Corporation
Document Number: 001-07160 Rev. *C
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised September 26, 2007
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