TaNFilm
®
High Temperature
DIP and SIP Networks
1900HT / 4700HT SERIES
·
·
·
·
·
Inherent reliability
Custom configurations available
Bonded leads not susceptible to solder reflow problems
Absolute tolerence to ±0.1% - ratio accuracy to ±0.05%
Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C
IRC Advanced Film Division
Ceramic sandwich construction with
high temperature epoxy encapsulent
Sputtered tantalum
nitride with passivation
oxide layer
Thermo-compression
bonded leads provide
exceptional reliability
The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low
profile, TaNFilm
®
DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics
of tantalum nitride film insure superior continuous performance in high temperature applications over the installed life of the part.
Electrical Data
Package
Type
Size
Schematic
Ohmic
Range
Package
Power
Element
Power
Rated Voltage
(not to exceed
rated power)
Temperature
Range
14
DIP
16
Isolated
Schematic A
Bussed
Schematic B
Isolated
Schematic A
Bussed
Schematic B
Isolated
Schematic G
Bussed
Schematic C
Isolated
Schematic G
Bussed
Schematic C
100Ω to 100KΩ
1.12W
1.00KΩ to 50KΩ
0.08W
100Ω to 100KΩ
1.28W
1.00KΩ to 50KΩ
-55°C to +200°C
50Ω to 50KΩ
0.24W
2.00KΩ to 25KΩ
0.08W
50Ω to 50KΩ
0.32W
2.00KΩ to 25KΩ
50V
100V
6
SIP
8
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
HT Series Issue November 2008 Sheet 1 of 3
TaNFilm
®
High Temperature
DIP and SIP Networks
Physical Data
1900HT DIP Series
A
IRC Advanced Film Division
# OF
LEADS
14
0.250″
DIM A
0.700" ± 0.020
0.800" ± 0.020
LEAD MATERIAL:
CDA 110 COPPER
½ HARD (EIP)
PLATED 30-50 µIN. NICKEL
25µIN MINIMUM GOLD
16
0.105″ ± 0.020
0.080″ Max
0.020″ Max
meniscus
0.135″ + 0.015
- 0.010
0.050″ ± 0.015
0.100″ ± 0.005
Typ. Non-Cumulative
0.050″ ± 0.003
0.025″
± 0.005
0.205″
0.010″
0.300″
+0.015/-0.010
0.020″ ± 0.001 Typ
0.010″ ± 0.001
Schematic A
Schematic A
N
N-1
Schematic B
Schematic B
N
N-1
Schematic G
Schematic C
N-2 . . .
N-2 . . .
R
N-1
R
1
R
2
R
3
...
R
1
...
R
2
R
1
R
2
...
R
1
R
2
R
N-1
1
1
2
2
3
4
N-1
N
1
2
3
N
3 ...
1
2
3...
N = Number of pins
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
HT Series Issue November 2008 Sheet 2 of 3
TaNFilm
®
High Temperature
DIP and SIP Networks
Physical Data (continued)
4700HT SIP Series
0.070″ ± 0.010
IRC Advanced Film Division
A
Pin 1 Indicator
0.187″ ± 0.010
0.130″ + 0.008/-0.010
# OF
LEADS
6
8
DIM A
0.580" ± 0.015
0.780" ± 0.015
0.322″ Ref
0.135″+ 0.015/-0.010
0.015″ Min
Clean Lead
Above Seating Plane
0.010″ ± 0.001
0.050″ ± 0.003
0.100″ ± 0.005
0.020″ ± 0.003
0.026″ ± 0.003
0.045″ ± 0.015
LEAD MATERIAL:
CDA 110 COPPER
½ HARD (EIP)
PLATED 30-50 µIN. NICKEL
25µIN MINIMUM GOLD
ematic A
N-1
Schematic B
N
N-1
Schematic G
Schematic C
N-2 . . .
N-2 . . .
Schematic G
R
1
Schematic C
R
1
R
N-1
R
3
R
2
...
R
1
...
R
2
R
2
...
R
2
R
N-1
1
2
2
3
4
N-1
N
1
2
3
N
3 ...
1
2
3...
N = Number of pins
Environmental Data
Environmental Test
MIL-PRF-55342
Thermal Shock
Short Time Overload
High Temperature Exposure
Effects of Solder
Moisture Resistance
Life
(1000 hours, 200°C, no load)
Life
(1000 hours, 150°C, rated power)
Performance
±0.02%
±0.02%
±0.03%
±0.01%
±0.03%
±0.08%
±0.02%
±0.10%
±0.05%
±0.10%
±0.10%
±0.10%
±1.0%
±0.05%
Typical
Maximum
Power Derating Curve
100
% Of Rated Power
50
10
50
100
150
200
Temperature in °C
Ordering Data
Package Prefix
DIP = 1900HT Series; SIP = 4700HT SIP Series
SIP - 4789HT - 03 - 1001 F
B
Optional Ratio Tolerance to R
1
F=±1.0%; D=±0.5%; C=±0.25%;
B = ±0.1%; A = ±0.05%
Model
1987HT = 14-pin DIP bussed schematic B
1989HT = 14-pin DIP isolated schematic A
1998HT = 16-pin DIP bussed schematic B
1999HT = 16-pin DIP isolated schematic A
4761HT = 6-pin SIP bussed schematic C
4769HT = 6-pin SIP isolated schematic G
4781HT = 8-pin SIP bussed schematic C
4789HT = 8-pin SIP isolated schematic G
Absolute Tolerance
Standard MIL tolerance code
J = ±5%; G = ±2%; F=±1.0%; D=±0.5%; C = ±0.25%; B = ±0.1%
Resistance
Standard MIL resistance code.
Example: 1001 = 1000
Ω;
50R0 = 50Ω
Absolute TCR
01 = ±100ppm/°C; 02 = ±50ppm/°C; 03 = ±25ppm/°C
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
HT Series Issue November 2008 Sheet 3 of 3
NXP MCU
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