电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1812A821K2GAL

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, BP, 30ppm/Cel TC, 0.00082uF, Surface Mount, 1812, CHIP
产品类别无源元件    电容器   
文件大小1MB,共8页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1812A821K2GAL概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, BP, 30ppm/Cel TC, 0.00082uF, Surface Mount, 1812, CHIP

C1812A821K2GAL规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Objectid1592789642
包装说明, 1812
Reach Compliance Codenot_compliant
ECCN代码EAR99
YTEOL4.97
电容0.00082 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度2.03 mm
JESD-609代码e0
长度4.57 mm
制造商序列号GR900
安装特点SURFACE MOUNT
多层Yes
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法TRAY
正容差10%
额定(直流)电压(URdc)200 V
系列C(SIZE)A
尺寸代码1812
表面贴装YES
温度特性代码BP
温度系数30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度3.18 mm

文档预览

下载PDF文档
CERAMIC HIGH RELIABILITY
GENERAL INFORMATION GR900 SERIES
HIGH RELIABILITY — GR900
/ Q-SPEC
GR900 capacitors are intended for use in any application where the
chance of failure must be reduced to the lowest possible level. While
any well-made multilayer ceramic capacitor is an inherently reliable
device, GR900 capacitors receive special attention in all phases of
manufacture including:
Raw Materials Selection
Clean Room Production
Individual Batch Testing
C-SAM (when applicable)
Singular Batch Identity is Maintained
Destructive Physical Analysis
These parts are well worth the added investment in comparison to the
cost of a device or system failure.
Typical applications include: Medical, Aerospace, Communication
Satellites, Radar and Guidance Systems.
SCREENING AND SAMPLE TESTS
Each batch receives the following testing/inspections:
In Process Inspection (Per MIL-PRF-123):
1.
2.
100% Visual Inspection.
Destructive Physical Analysis: (DPA) - A sample is pulled from
each lot and examined per EIA-469 and KEMET’s strict internal
void and delamination criteria. Sampling plan is per MIL-PRF-123.
C-SAM (GR900 / “A” in the fifth character position of the ordering
code): May be performed on batches failing to meet the DPA
criteria for removal of marginal product. Not required on each lot.
C-SAM (Q-SPEC / “Q” in the fifth character position of the ordering
code): Receive 100% C-SAM of lot prior to application of end
metallization.
Group A
1. Thermal Shock:
Materials used in the construction of multilayer
ceramic capacitors possess various thermal coefficients of expansion.
To assure maximum uniformity, each part is temperature cycled in
accordance to MIL-STD-202, Method 107, Condition A with Step 3
being 125°C. Number of cycles shall be 20 (100% of lot).
2. Voltage Conditioning:
One of the most strenuous environments for
any capacitor is the high temperature/high voltage test. All units are
subject to twice-rated voltage to the units at the maximum rated
temperature of 125°C for a minimum of 168 hours and a maximum of
264 hours. The voltage conditioning may be terminated at any time
during 168 hours to 264 hours time interval that confirmed failures meet
the requirements of the PDA during the last 48 hours of 1 unit or .4%
(100% of lot).
Optional Voltage Conditioning (Accelerated Voltage
Conditioning):
All conditions of the standard voltage conditioning
apply with the exception of increased voltage and decreased test time.
Refer to MIL-PRF-123 for the proper formula.
*Step 5 is performed on chips at this point (100% of lot).
3. Dielectric Withstanding Voltage:
250% of the DC rated voltage at
25°C (100% of lot).
9. Percent Defective Allowable (PDA):
The overall PDA is 8% for
parts outside the MIL-PRF-123 values. The PDA is per MIL-PRF-
123 for all parts that are valid MIL-PRF-123 values. The PD
includes steps 1 through 8 above with the following exceptions.
Capacitance exclusion - capacitance values no more than 5% or
.5pF, whichever is greater for BX characteristic or 1% or .3pF,
whichever is greater for BP characteristic beyond specified
tolerance limit, shall be removed from the lot but shall not be
considered defective for determination of the PD.
Insulation Resistance at 25°C — Product which is not acceptable
for twice the military limit but is acceptable per the military limit, is
removed from the lot but shall not be considered defective for
determination of the PD.
10. Visual and Mechanical Examination:
Performed per MIL-
PRF-123 criteria.
11. Radiographic Examination (Leaded Devices Only):
Radial
devices receive a one-plane X-ray.
12. Destructive Physical Analysis (DPA):
A sample is examined
on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.
STANDARD PACKAGING
All products are packaged in trays except C512 capacitors which
are packaged 1 piece per bag.
*Note: All packaging is ESD protected.
DATA PACKAGE
A data package is sent with each shipment which contains:
1. Final Destructive Physical Analysis (DPA) report.
2. Certificate of Compliance stating that the parts meet all
applicable requirements of the appropriate military specification to
the best failure level to which KEMET is approved.
3. Summary of Group A Testing.
Group B
MIL-PRF-123 Group B testing is available with special order.
Please contact KEMET for additional information and ordering
details.
4. Insulation Resistance:
The 25°C measurement with rated
voltage applied shall be the lesser of 100 GΩ or 1000 Megohm -
Microfarads (100% of lot).
*5. Insulation Resistance:
The 125°C measurement with rated
voltage applied shall be the lesser of 10 GΩ or 100 Megohm -
Microfarads (100% of lot). For chips, 125°C IR is performed prior to
Step 3 above.
6. Storage
at 150°C for 2 hours minimum without voltage applied
followed by a 12-hour minimum stabilization period (temperature
characteristic BX only).
7. Capacitance:
Shall be within specified tolerance at 25°C (100%
of lot). (Aging phenomenon is taken into account for BX dielectric
to obtain capacitance.)
8. Dissipation Factor:
Shall not exceed 2.5% for X7R (BX)
dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)
3.
12
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
TIMx的PWM输入模式有什么需要注意的?
RT.想检测方波周期.这PWM输入模式怎么总是不工作?刚才调出来一次.过了一会.就不行了.不进中断..郁闷...
astwyg stm32/stm8
关于NXP针对Type C接口微控制器电路板有奖征集评测创意活动的延期通知
活动详情:https://www.eeworld.com.cn/huodong//201509_NXP/index.html NXP针对Type C接口微控制器电路板有奖征集评测创意活动自开展以来,受到网友们的热烈欢迎{:1_124:},大家的积极程 ......
EEWORLD社区 单片机
flash烧写咨询
目前程序烧写成功了,但是下一步要调试,而且还要连着串口进行调试,232通讯,有同学能告诉我下,通过flash烧写成功后,要进行调试后的具体操作步骤?能详细尽量详细,包括板子上的一些短接线 ......
cumtliyan 微控制器 MCU
如何在开发嵌入式系统时做出明智的选择
本文将描述嵌入式实时系统的关键特征,然后讨论如何在所选择或所开发的硬件和软件构件的基础上开发一个高效的嵌入式系统方案,并介绍开发这些系统所需的独特关键处理技术。 许多系统设计师将执 ......
lorant 嵌入式系统
stm32F429用模拟IIC驱动AD5933测量人体阻抗小阻抗),写入寄存器后读出的都是FF求解
代码: void SetPointer(char nAddr) // 设置地址指针 { int nTemp = 0x1A; // AD5933的默认地址&写控制位(低) IIC_Start(); IIC_Send_Byte(nTemp); // 发 ......
麻辣鸡丶 ADI 工业技术
跟着神车一起栽!!
本帖最后由 dontium 于 2015-6-13 20:45 编辑 小打小闹,投入股市的资金一再增长,一直在庆幸炒了十来多把,只有一次亏了21块钱,{:1_138:} 当赚到的近两千时,心想,离我 ......
dontium 聊聊、笑笑、闹闹

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2777  1008  1099  2223  399  56  21  23  45  9 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved