AP9587GH/J-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
▼
Simple Drive Requirement
▼
Lower Gate Charge
▼
Fast Switching Characteristic
▼
RoHS Compliant & Halogen-Free
G
P-CHANNEL ENHANCEMENT MODE
POWER MOSFET
D
BV
DSS
R
DS(ON)
I
D
-80V
300mΩ
-6.1A
S
Description
Advanced Power MOSFETs from APEC provide the designer with the best
combination of fast switching, ruggedized device design, low on-resistance and
cost-effectiveness.
The TO-252 package is widely preferred for all commercial-industrial surface
mount applications and suited for low voltage applications such as DC/DC
converters. The through-hole version (AP9587GJ) is available for low-profile
applications.
G
D
S
TO-252(H)
G
D
S
TO-251(J)
Absolute Maximum Ratings
Symbol
V
DS
V
GS
I
D
@T
C
=25℃
I
D
@T
C
=100℃
I
DM
P
D
@T
C
=25℃
P
D
@T
A
=25℃
T
STG
T
J
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
1
Total Power Dissipation
Total Power Dissipation
3
Storage Temperature Range
Operating Junction Temperature Range
Rating
-80
+20
-6.1
-3.9
-24
20.8
2
-55 to 150
-55 to 150
Units
V
V
A
A
A
W
W
℃
℃
Thermal Data
Symbol
Rthj-c
Rthj-a
Rthj-a
Parameter
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient (PCB mount)
3
Value
6
62.5
110
Units
℃/W
℃/W
℃/W
1
201110192
Maximum Thermal Resistance, Junction-ambient
Data and specifications subject to change without notice
AP9587GH/J-HF
Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
BV
DSS
R
DS(ON)
Parameter
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
2
Test Conditions
V
GS
=0V, I
D
=-250uA
V
GS
=-10V, I
D
=-4A
V
GS
=-4.5V, I
D
=-3A
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
R
g
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Gate-Source Leakage
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V
DS
=V
GS
, I
D
=-250uA
V
DS
=-10V, I
D
=-4A
V
DS
=-64V, V
GS
=0V
V
GS
=+20V, V
DS
=0V
I
D
=-4A
V
DS
=-64V
V
GS
=-4.5V
V
DS
=-40V
I
D
=-4A
R
G
=3.3Ω
V
GS
=-10V
V
GS
=0V
V
DS
=-25V
f=1.0MHz
f=1.0MHz
Min.
-80
-
-
-1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
-
-
-
6
-
-
6
1.5
3.3
7
8
14
4
450
50
35
4.8
Max. Units
-
300
400
-3
-
-25
+100
9.6
-
-
-
-
-
-
720
-
-
9.6
V
mΩ
mΩ
V
S
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
Ω
Source-Drain Diode
Symbol
V
SD
t
rr
Q
rr
Parameter
Forward On Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
Test Conditions
I
S
=-4A, V
GS
=0V
I
S
=-4A, V
GS
=0V,
dI/dt=-100A/µs
Min.
-
-
-
Typ.
-
33
50
Max. Units
-1.3
-
-
V
ns
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in
2
copper pad of FR4 board
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP9587GH/J-HF
20
14
T
C
= 25
o
C
16
-I
D
, Drain Current (A)
-I
D
, Drain Current (A)
-10V
-7.0V
-6.0V
-5.0V
12
T
C
= 150
o
C
10
-10V
- 7 .0V
- 6 .0V
- 5.0 V
V
G
= - 4 .0 V
12
8
V
G
= - 4 .0 V
8
6
4
4
2
0
0
2
4
6
8
10
12
14
16
18
0
0
2
4
6
8
10
12
14
-V
DS
, Drain-to-Source Voltage (V)
-V
DS
, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
300
2.0
I
D
= -3 A
T
C
=25
℃
Normalized R
DS(ON)
280
I
D
= -4 A
V
G
= - 10V
1.6
R
DS(ON)
(m
Ω
)
260
1.2
240
0.8
220
0.4
2
4
6
8
10
-50
0
50
100
150
-V
GS
, Gate-to-Source Voltage (V)
T
j
, Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
2.0
4.0
I
D
= -250uA
Normalized -V
GS(th)
(V)
1.2
1.5
-I
S
(A)
2.0
1.0
T
j
=150
o
C
T
j
=25
o
C
0.5
0.0
0.0
0
0.2
0.4
0.6
0.8
1
-50
0
50
100
150
-V
SD
, Source-to-Drain Voltage (V)
T
j
, Junction Temperature ( C)
o
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP9587GH/J-HF
10
600
f=1.0MHz
-V
GS
, Gate to Source Voltage (V)
I
D
= -4A
V
DS
= -64V
8
500
C
iss
400
C (pF)
6
300
4
200
2
100
0
0
2
4
6
8
10
12
0
1
5
9
13
17
21
25
C
oss
C
rss
29
Q
G
, Total Gate Charge (nC)
-V
DS
, Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (R
thjc
)
Duty factor=0.5
-I
D
(A)
10
Operation in this area
limited by R
DS(ON)
0.2
0.1
100us
0.1
0.05
P
DM
0.02
0.01
1
t
T
Duty factor = t/T
Peak T
j
= P
DM
x R
thjc
+ T
C
T
C
=25
o
C
Single Pulse
0.1
0.1
1
10
1ms
10ms
100ms
DC
100
1000
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
-V
DS
, Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
8
8
V
DS
= -5V
-I
D
, Drain Current (A)
6
-I
D
, Drain Current (A)
T
j
=150
o
C
T
j
=-40
o
C
T
j
=25 C
o
6
4
4
2
2
0
0
1
2
3
4
5
6
0
25
50
75
100
125
150
-V
GS
, Gate-to-Source Voltage (V)
T
c
, Case Temperature ( C )
o
Fig 11. Transfer Characteristics
Fig 12. Maximum Continuous Drain Current
v.s. Case Temperature
4
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