3.3 V, 100 MHz, 43 V/us, Fully Differential CMOS Amplifier w/Shutdown 8-MSOP-PowerPAD -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | MSOP |
| 包装说明 | HTSSOP, TSSOP8,.19 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.0000012 µA |
| 标称共模抑制比 | 96 dB |
| 最大输入失调电压 | 9000 µV |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | |
| 标称负供电电压 (Vsup) | |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HTSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.07 mm |
| 标称压摆率 | 55 V/us |
| 最大压摆率 | 11 mA |
| 供电电压上限 | 3.6 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| THS4120IDGNG4 | THS4121CDGNR | THS4121IDG4 | THS4120IDG4 | THS4120IDGKG4 | |
|---|---|---|---|---|---|
| 描述 | 3.3 V, 100 MHz, 43 V/us, Fully Differential CMOS Amplifier w/Shutdown 8-MSOP-PowerPAD -40 to 85 | Differential Amplifiers Fully Differential CMOS | 3.3 V, 100 MHz, 43 V/us, Fully Differential CMOS Amplifier 8-SOIC -40 to 85 | 3.3 V, 100 MHz, 43 V/us, Fully Differential CMOS Amplifier w/Shutdown 8-SOIC -40 to 85 | 3.3 V, 100 MHz, 43 V/us, Fully Differential CMOS Amplifier w/Shutdown 8-VSSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | MSOP | MSOP | SOIC | SOIC | MSOP |
| 包装说明 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 |
| 针数 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.0000012 µA | 0.0000012 µA | 0.0000012 µA | 0.0000012 µA | 0.0000012 µA |
| 标称共模抑制比 | 96 dB | 96 dB | 96 dB | 96 dB | 96 dB |
| 最大输入失调电压 | 9000 µV | 9000 µV | 9000 µV | 9000 µV | 9000 µV |
| JESD-30 代码 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | 3 mm | 4.9 mm | 4.9 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HTSSOP | HTSSOP | SOP | SOP | TSSOP |
| 封装等效代码 | TSSOP8,.19 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 | TSSOP8,.19 |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.07 mm | 1.07 mm | 1.75 mm | 1.75 mm | 1.1 mm |
| 标称压摆率 | 55 V/us | 55 V/us | 55 V/us | 55 V/us | 55 V/us |
| 最大压摆率 | 11 mA | 11 mA | 16 mA | 16 mA | 16 mA |
| 供电电压上限 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3 mm | 3.9 mm | 3.9 mm | 3 mm |
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