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74LVT241DB,118

产品描述buffers & line drivers 3.3V octal buf 3-S
产品类别逻辑    逻辑   
文件大小97KB,共17页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74LVT241DB,118概述

buffers & line drivers 3.3V octal buf 3-S

74LVT241DB,118规格参数

参数名称属性值
Brand NameNXP Semiconduc
是否Rohs认证符合
零件包装代码SSOP2
包装说明5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20
针数20
制造商包装代码SOT339-1
Reach Compliance Codecompli
其他特性OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION
控制类型ENABLE LOW/HIGH
系列LVT
JESD-30 代码R-PDSO-G20
JESD-609代码e4
长度7.2 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.064 A
湿度敏感等级1
位数4
功能数量2
端口数量2
端子数量20
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SSOP
封装等效代码SSOP20,.3
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源3.3 V
最大电源电流(ICC)12 mA
Prop。Delay @ Nom-Su3.8 ns
传播延迟(tpd)4 ns
认证状态Not Qualified
座面最大高度2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层NICKEL PALLADIUM GOLD
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度5.3 mm
Base Number Matches1

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74LVT241
3.3 V octal buffer/line driver; 3-state
Rev. 03 — 7 May 2008
Product data sheet
1. General description
The 74LVT241 high-performance BiCMOS device combines low static and dynamic power
dissipation with high speed and high output drive.
This device is an octal buffer that is ideal for driving bus lines. The device features two
output enables (1OE, 2OE), each controlling four of the 3-state outputs.
2. Features
I
I
I
I
I
I
I
3-state buffers
Octal bus interface
Input and output interface capability to systems at 5 V supply
TTL input and output switching levels
Output capability: +64 mA/−32 mA
Latch-up protection exceeds 500 mA per JESD78 class II level A
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
Bus-hold data inputs eliminate the need for external pull-up resistors for unused inputs
Live insertion/extraction permitted
Power-up 3-state
No bus current loading when output is tied to 5 V bus
I
I
I
I
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74LVT241D
74LVT241DB
74LVT241PW
74LVT241BQ
−40 °C
to +85
°C
−40 °C
to +85
°C
−40 °C
to +85
°C
−40 °C
to +85
°C
SO20
SSOP20
TSSOP20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT339-1
SOT360-1
SOT764-1
Type number
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm

74LVT241DB,118相似产品对比

74LVT241DB,118 74LVT241D,118 74LVT241PW,118 74LVT241BQ,115 74LVT241D,112
描述 buffers & line drivers 3.3V octal buf 3-S buffers & line drivers 3.3V octal buffer buffers & line drivers 3.3V octal buffer/ driver 3-S buffers & line drivers 3.3V octal buf/drv3s buffers & line drivers 3.3V octal buffer
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor NXP Semiconduc
是否Rohs认证 符合 符合 符合 符合 符合
零件包装代码 SSOP2 SOP TSSOP2 QFN SOP
包装说明 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20 7.50 MM, PLASTIC, MS-013, SOT-163-1, SOP-20 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20 7.50 MM, PLASTIC, MS-013, SOT-163-1, SOP-20
针数 20 20 20 20 20
制造商包装代码 SOT339-1 SOT163-1 SOT360-1 SOT764-1 SOT163-1
Reach Compliance Code compli compli compli compliant compli
其他特性 OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION
控制类型 ENABLE LOW/HIGH ENABLE LOW/HIGH ENABLE LOW/HIGH ENABLE LOW/HIGH ENABLE LOW/HIGH
系列 LVT LVT LVT LVT LVT
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20
长度 7.2 mm 12.8 mm 6.5 mm 4.5 mm 12.8 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.064 A 0.064 A 0.064 A 0.064 A 0.064 A
湿度敏感等级 1 1 1 1 1
位数 4 4 4 4 4
功能数量 2 2 2 2 2
端口数量 2 2 2 2 2
端子数量 20 20 20 20 20
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP SOP TSSOP HVQCCN SOP
封装等效代码 SSOP20,.3 SOP20,.4 TSSOP20,.25 LCC20,.1X.18,20 SOP20,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
包装方法 TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TUBE
峰值回流温度(摄氏度) 260 260 260 260 260
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
传播延迟(tpd) 4 ns 4 ns 4 ns 4 ns 4 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2 mm 2.65 mm 1.1 mm 1 mm 2.65 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
端子形式 GULL WING GULL WING GULL WING NO LEAD GULL WING
端子节距 0.65 mm 1.27 mm 0.65 mm 0.5 mm 1.27 mm
端子位置 DUAL DUAL DUAL QUAD DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30
宽度 5.3 mm 7.5 mm 4.4 mm 2.5 mm 7.5 mm
Base Number Matches 1 1 1 1 1
JESD-609代码 e4 e4 - e4 e4
最大电源电流(ICC) 12 mA 12 mA 12 mA - 12 mA
Prop。Delay @ Nom-Su 3.8 ns 3.8 ns 3.8 ns - 3.8 ns

 
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