Latches Octal Trans D Type Latches
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, SSOP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 系列 | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 7.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.016 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 15 ns |
| 传播延迟（tpd） | 15 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5.3 mm |
| SN74LV373ATDBR | SN74LV373ATPW | SN74LV373ATDB | SN74LV373ATDBE4 | SN74LV373ATRGYR | SN74LV373ATDBG4 | SN74LV373ATRGYRG4 | |
|---|---|---|---|---|---|---|---|
| 描述 | Latches Octal Trans D Type Latches | Latches Octal Transp DType Latch | Latches Octal Transp DType Latch | Latches Octal Transp DType Latch | Latches Octal Trans D-Type | Latches Octal Transp DType Latch | Latches Octal Transp DType Latch |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SSOP | TSSOP | SSOP | SSOP | QFN | SSOP | QFN |
| 包装说明 | SSOP, SSOP20,.3 | TSSOP, TSSOP20,.25 | SSOP, SSOP20,.3 | SSOP, SSOP20,.3 | GREEN, PLASTIC, MO-241BC, QFN-20 | SSOP, SSOP20,.3 | PLASTIC, MO-241BC, QFN-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compli | unknow | unknow | unknow | unknow | unknow | unknow |
| Factory Lead Time | 1 week | 1 week | 1 week | - | 1 week | - | - |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | - | - | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | - | - | R-PQCC-N20 | R-PDSO-G20 | R-PQCC-N20 |
| JESD-609代码 | e4 | e4 | - | - | e4 | e4 | e4 |
| 长度 | 7.2 mm | 6.5 mm | - | - | 4.5 mm | 7.2 mm | 4.5 mm |
| 负载电容（CL） | 50 pF | 50 pF | - | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.016 A | 0.016 A | - | - | 0.016 A | 0.016 A | 0.016 A |
| 湿度敏感等级 | 1 | 1 | - | - | 2 | 1 | 2 |
| 位数 | 8 | 8 | - | - | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | - | - | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | - | - | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | - | - | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | - | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | - | - | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | TSSOP | - | - | HVQCCN | SSOP | HVQCCN |
| 封装等效代码 | SSOP20,.3 | TSSOP20,.25 | - | - | LCC20/24,.14X.18,20 | SSOP20,.3 | LCC20/24,.14X.18,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL | TUBE | - | - | TAPE AND REEL | TUBE | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | - | - | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 15 ns | 15 ns | - | - | 15 ns | 15 ns | 15 ns |
| 传播延迟（tpd） | 15 ns | 15 ns | - | - | 15 ns | 15 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 1.2 mm | - | - | 1 mm | 2 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | - | YES | YES | YES |
| 技术 | CMOS | CMOS | - | - | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | - | - | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | - | - | 0.5 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | - | - | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5.3 mm | 4.4 mm | - | - | 3.5 mm | 5.3 mm | 3.5 mm |
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