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74AUP2G125GT,115

产品描述buffers & line drivers 1.8V dual bus buffer
产品类别逻辑    逻辑   
文件大小301KB,共24页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AUP2G125GT,115概述

buffers & line drivers 1.8V dual bus buffer

74AUP2G125GT,115规格参数

参数名称属性值
Brand NameNXP Semiconduc
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SON
包装说明1 X 1.95 MM, 0.50 MM HEIGHT, MO-252, SOT833-1, SON-8
针数8
制造商包装代码SOT833-1
Reach Compliance Codecompli
控制类型ENABLE LOW
系列AUP/ULP/V
JESD-30 代码R-PDSO-N8
JESD-609代码e3
长度1.95 mm
负载电容(CL)30 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.0017 A
湿度敏感等级1
位数1
功能数量2
端口数量2
端子数量8
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码VSON
封装等效代码SOLCC8,.04,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, VERY THIN PROFILE
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源1.2/3.3 V
Prop。Delay @ Nom-Su24 ns
传播延迟(tpd)24 ns
认证状态Not Qualified
座面最大高度0.5 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)0.8 V
标称供电电压 (Vsup)1.1 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Tin (Sn)
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度1 mm

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74AUP2G125
Low-power dual buffer/line driver; 3-state
Rev. 10 — 8 February 2013
Product data sheet
1. General description
The 74AUP2G125 provides the dual non-inverting buffer/line driver with 3-state output.
The 3-state output is controlled by the output enable input (nOE). A HIGH level at pin nOE
causes the output to assume a high-impedance OFF-state. This device has the
input-disable feature, which allows floating input signals. The inputs are disabled when the
output enable input nOE) is HIGH.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V. This device ensures a very low
static and dynamic power consumption across the entire V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables the output, preventing a damaging backflow current through the device
when it is powered down.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9
A
(maximum)
Latch-up performance exceeds 100 mA per JESD78B Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
Input-disable feature allows floating input conditions
I
OFF
circuitry provides partial power-down mode operation
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C

74AUP2G125GT,115相似产品对比

74AUP2G125GT,115 74AUP2G125GN,115 74AUP2G125GM,125 74AUP2G125DC,125
描述 buffers & line drivers 1.8V dual bus buffer buffers & line drivers 1.8V dual buffer driver (3-state) buffers & line drivers 1.8V dual bus buffer buffers & line drivers 1.8V dual bus buffer
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
是否Rohs认证 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SON SON QFN SSOP
包装说明 1 X 1.95 MM, 0.50 MM HEIGHT, MO-252, SOT833-1, SON-8 1.20 X 1 MM, 0.35 MM HEIGHT, SOT-1116, SON-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1. QFN-8 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
针数 8 8 8 8
制造商包装代码 SOT833-1 SOT1116 SOT902-2 SOT765-1
Reach Compliance Code compli compli compli compli
控制类型 ENABLE LOW - ENABLE LOW ENABLE LOW
系列 AUP/ULP/V - AUP/ULP/V AUP/ULP/V
JESD-30 代码 R-PDSO-N8 - S-PBCC-B8 R-PDSO-G8
长度 1.95 mm - 1.6 mm 2.3 mm
负载电容(CL) 30 pF - 30 pF 30 pF
逻辑集成电路类型 BUS DRIVER - BUS DRIVER BUS DRIVER
最大I(ol) 0.0017 A - 0.0017 A 0.0017 A
湿度敏感等级 1 - 1 1
位数 1 - 1 1
功能数量 2 - 2 2
端口数量 2 - 2 2
端子数量 8 - 8 8
最高工作温度 125 °C - 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C
输出特性 3-STATE - 3-STATE 3-STATE
输出极性 TRUE - TRUE TRUE
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VSON - VBCC VSSOP
封装等效代码 SOLCC8,.04,20 - LCC8,.06SQ,20 TSSOP8,.12,20
封装形状 RECTANGULAR - SQUARE RECTANGULAR
封装形式 SMALL OUTLINE, VERY THIN PROFILE - CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
包装方法 TAPE AND REEL - TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 - 260 260
电源 1.2/3.3 V - 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su 24 ns - 24 ns 24 ns
传播延迟(tpd) 24 ns - 24 ns 24 ns
认证状态 Not Qualified - Not Qualified Not Qualified
座面最大高度 0.5 mm - 0.5 mm 1 mm
最大供电电压 (Vsup) 3.6 V - 3.6 V 3.6 V
最小供电电压 (Vsup) 0.8 V - 0.8 V 0.8 V
标称供电电压 (Vsup) 1.1 V - 1.1 V 1.1 V
表面贴装 YES - YES YES
技术 CMOS - CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
端子面层 Tin (Sn) - NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU)
端子形式 NO LEAD - BUTT GULL WING
端子节距 0.5 mm - 0.5 mm 0.5 mm
端子位置 DUAL - BOTTOM DUAL
处于峰值回流温度下的最长时间 30 - 30 30
宽度 1 mm - 1.6 mm 2 mm

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