translation - voltage levels 6ch high-speed
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | BGA |
包装说明 | VFBGA, BGA16,4X4,20 |
针数 | 16 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
Is Samacsys | N |
接口集成电路类型 | INTERFACE CIRCUIT |
JESD-30 代码 | S-PBGA-B16 |
长度 | 2 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装等效代码 | BGA16,4X4,20 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 2.5/3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 0.67 mm |
最大供电电压 | 3.2 V |
最小供电电压 | 1.62 V |
标称供电电压 | 1.8 V |
电源电压1-最大 | 3.6 V |
电源电压1-分钟 | 2.2 V |
电源电压1-Nom | 3.3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 2 mm |
Base Number Matches | 1 |
MAX13035EEBE+T | AP0704GMT-HF_14 | MAX13032EETE+T | MAX13032EEBE+T | MAX13030EETE+T | MAX13035EETE+ | |
---|---|---|---|---|---|---|
描述 | translation - voltage levels 6ch high-speed | Simple Drive Requirement | translation - voltage levels 6ch high-speed | translation - voltage levels 6ch high-speed | translation - voltage levels 6ch high-speed | translation - voltage levels 6ch high-speed |
是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | BGA | - | QFN | BGA | QFN | QFN |
包装说明 | VFBGA, BGA16,4X4,20 | - | HVQCCN, LCC16,.16SQ,25 | 2 X 2 MM, LEAD FREE, UCSP-16 | HVQCCN, LCC16,.16SQ,25 | HVQCCN, LCC16,.16SQ,25 |
针数 | 16 | - | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | - | compli | compli | compliant | compliant |
ECCN代码 | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
Factory Lead Time | 1 week | - | 6 weeks | 1 week | 6 weeks | - |
接口集成电路类型 | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
JESD-30 代码 | S-PBGA-B16 | - | S-XQCC-N16 | S-PBGA-B16 | S-XQCC-N16 | S-XQCC-N16 |
长度 | 2 mm | - | 4 mm | 2 mm | 4 mm | 4 mm |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 16 | - | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
封装代码 | VFBGA | - | HVQCCN | VFBGA | HVQCCN | HVQCCN |
封装等效代码 | BGA16,4X4,20 | - | LCC16,.16SQ,25 | BGA16,4X4,20 | LCC16,.16SQ,25 | LCC16,.16SQ,25 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | 260 |
电源 | 2.5/3.3 V | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.67 mm | - | 0.8 mm | 0.67 mm | 0.8 mm | 0.8 mm |
最大供电电压 | 3.2 V | - | 3.2 V | 3.2 V | 3.2 V | 3.2 V |
最小供电电压 | 1.62 V | - | 1.62 V | 1.62 V | 1.62 V | 1.62 V |
标称供电电压 | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
电源电压1-最大 | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
电源电压1-分钟 | 2.2 V | - | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
电源电压1-Nom | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | YES | YES | YES |
技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | - | NO LEAD | BALL | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | - | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm |
端子位置 | BOTTOM | - | QUAD | BOTTOM | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 |
宽度 | 2 mm | - | 4 mm | 2 mm | 4 mm | 4 mm |
JESD-609代码 | - | - | e3 | e1 | e3 | e3 |
端子面层 | - | - | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Matte Tin (Sn) |
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