K7M803625B
K7M801825B
Document Title
256Kx36 & 512Kx18 Flow-Through NtRAM
TM
256Kx36 & 512Kx18-Bit Flow Through NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
1.0
History
1. Initial document.
1. Add x32 org part and industrial temperature part
1. change scan order(1) form 4T to 6T at 119BGA(x18)
1. Final spec release
2. Change I
SB2
form 50mA to 60mA
Change ordering information( remove 225MHz at Nt-Pipelined)
1. Delete 119BGA package
1. Remove x32 organization
2. Remove -85 speed bin
Draft Date
May. 18. 2001
Aug. 11. 2001
Aug. 28. 2001
Nov. 16. 2001
Remark
Preliminary
Preliminary
Preliminary
Final
2.0
2.1
3.0
April. 01. 2002
April. 04. 2003
Nov. 17. 2003
Final
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
Nov. 2003
Rev 3.0
K7M803625B
K7M801825B
FEATURES
256Kx36 & 512Kx18 Flow-Through NtRAM
TM
256Kx36 & 512Kx18-Bit Flow Through NtRAM
TM
GENERAL DESCRIPTION
The K7M803625B and K7M801825B are
9,437,184-bit Synchronous Static SRAMs.
The NtRAM
TM
, or No Turnaround Random Access Memory uti-
lizes all bandwidth in any combination of operating cycles.
Address, data inputs, and all control signals except output
enable and linear burst order are synchronized to input clock.
Burst order control must be tied "High or Low".
Asynchronous inputs include the sleep mode enable(ZZ).
Output Enable controls the outputs at any given time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-chip
write pulse generation
and provides increased timing flexibility for incoming signals.
For read cycles, Flow-Through SRAM allows output data to
simply flow freely from the memory array.
The K7M803625B and K7M801825B are implemented with
SAMSUNG′s high performance CMOS technology and is avail-
able in 100pin TQFP and Multiple power and ground pins mini-
mize ground bounce.
• 3.3V+0.165V/-0.165V Power Supply.
• I/O Supply Voltage 3.3V+0.165V/-0.165V for 3.3V I/O
or 2.5V+0.4V/-0.125V for 2.5V I/O
• Byte Writable Function.
•
Εnable
clock and suspend operation.
• Single READ/WRITE control pin.
• Self-Timed Write Cycle.
• Three Chip Enable for simple depth expansion with no data
contention .
• A interleaved burst or a linear burst mode.
• Asynchronous output enable control.
• Power Down mode.
• TTL-Level Three-State Outputs.
• 100-TQFP-1420A
• Operating in commeical and industrial temperature range.
FAST ACCESS TIMES
Parameter
Cycle Time
Clock Access Time
Output Enable Access Time
Symbol
t
CYC
t
CD
t
OE
-65
7.5
6.5
3.5
-75 Unit
8.5
7.5
3.5
ns
ns
ns
LOGIC BLOCK DIAGRAM
LBO
ADDRESS
REGISTER
A
2
~A
17
or A
2
~A
18
A
0
~A
1
BURST
ADDRESS
COUNTER
A [0:17]or
A [0:18]
A′
0
~A′
1
256Kx36 , 512Kx18
MEMORY
ARRAY
CLK
CKE
K
WRITE
ADDRESS
REGISTER
K
DATA-IN
REGISTER
CONTROL
LOGIC
CS
1
CS
2
CS
2
ADV
WE
BW
x
(x=a,b,c,d or a,b)
OE
ZZ
DQa
0
~ DQd
7
or DQa
0
~ DQb
8
DQPa ~ DQPd
CONTROL
REGISTER
CONTROL
LOGIC
BUFFER
36 or 18
NtRAM
TM
and No Turnaround Random Access Memory are trademarks of Samsung,
and its architecture and functionalities are supported by NEC and Toshiba.
-3-
Nov. 2003
Rev 3.0
K7M803625B
K7M801825B
PIN CONFIGURATION
(TOP VIEW)
BWd
256Kx36 & 512Kx18 Flow-Through NtRAM
TM
BWb
BWa
BWc
CKE
ADV
N.C.
CLK
CS
1
CS
2
CS
2
V
DD
V
SS
WE
A
6
A
17
83
OE
A
7
A
8
82
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
81
A
9
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
N.C.
N.C.
N.C.
N.C.
V
SS
A
5
A
4
A
3
A
2
A
1
A
0
A
10
A
12
A
13
A
14
A
15
LBO
V
DD
PIN NAME
SYMBOL
A
0
- A
17
PIN NAME
Address Inputs
TQFP PIN NO.
SYMBOL
V
DD
V
SS
N.C.
DQa
0
~a
7
DQb
0
~b
7
DQc
0
~c
7
DQd
0
~d
7
DQPa~P
d
V
DDQ
V
SSQ
PIN NAME
TQFP PIN NO.
32,33,34,35,36,37,44
45,46,47,48,49,50,81
82,83,99,100
85
Address Advance/Load
ADV
Read/Write Control Input 88
WE
89
Clock
CLK
87
Clock Enable
CKE
98
Chip Select
CS
1
97
Chip Select
CS
2
92
Chip Select
CS
2
93,94,95,96
BWx(x=a,b,c,d) Byte Write Inputs
86
Output Enable
OE
64
Power Sleep Mode
ZZ
31
Burst Mode Control
LBO
Power Supply(+3.3V) 15,16,41,65,91
14,17,40,66,67,90
Ground
38,39,42,43,84
No Connect
Data Inputs/Outputs
52,53,56,57,58,59,62,63
68,69,72,73,74,75,78,79
2,3,6,7,8,9,12,13
18,19,22,23,24,25,28,29
51,80,1,30
A
11
Output Power Supply 4,11,20,27,54,61,70,77
(2.5V or 3.3V)
5,10,21,26,55,60,71,76
Output Ground
Notes :
1. The pin 84 is reserved for address bit for the 16Mb NtRAM.
2. A
0
and A
1
are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.
-4-
A
16
50
DQPc
DQc
0
DQc
1
V
DDQ
V
SSQ
DQc
2
DQc
3
DQc
4
DQc
5
V
SSQ
V
DDQ
DQc
6
DQc
7
Vss
V
DD
V
DD
V
SS
DQd
0
DQd
1
V
DDQ
V
SSQ
DQd
2
DQd
3
DQd
4
DQd
5
V
SSQ
V
DDQ
DQd
6
DQd
7
DQPd
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
100 Pin TQFP
(20mm x 14mm)
K7M803625B(256Kx36)
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DQPb
DQb
7
DQb
6
V
DDQ
V
SSQ
DQb
5
DQb
4
DQb
3
DQb
2
V
SSQ
V
DDQ
DQb
1
DQb
0
V
SS
V
SS
V
DD
ZZ
DQa
7
DQa
6
V
DDQ
V
SSQ
DQa
5
DQa
4
DQa
3
DQa
2
V
SSQ
V
DDQ
DQa
1
DQa
0
DQPa
Nov. 2003
Rev 3.0
K7M803625B
K7M801825B
PIN CONFIGURATION
(TOP VIEW)
256Kx36 & 512Kx18 Flow-Through NtRAM
TM
BWb
BWa
CKE
ADV
CS
2
N.C.
N.C.
N.C.
CLK
CS
1
CS
2
V
DD
V
SS
WE
A
6
A
18
83
OE
A
7
A
8
82
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
81
A
9
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
N.C.
N.C.
N.C.
N.C.
V
SS
A
5
A
4
A
3
A
2
A
1
A
0
A
12
A
13
A
14
A
15
A
16
LBO
V
DD
PIN NAME
SYMBOL
A
0
- A
18
PIN NAME
Address Inputs
TQFP PIN NO.
32,33,34,35,36,37,44
45,46,47,48,49,50,80
81,82,83,99,100
85
88
89
87
98
97
92
93,94
86
64
31
SYMBOL
V
DD
V
SS
N.C.
PIN NAME
Power Supply(+3.3V)
Ground
No Connect
TQFP PIN NO.
15,16,41,65,91
14,17,40,66,67,90
1,2,3,6,7,25,28,29,30,
38,39,42,43,51,52,53,
56,57,75,78,79,84,95,96
58,59,62,63,68,69,72,73,74
8,9,12,13,18,19,22,23,24
ADV
WE
CLK
CKE
CS
1
CS
2
CS
2
BWx(x=a,b)
OE
ZZ
LBO
Address Advance/Load
Read/Write Control Input
Clock
Clock Enable
Chip Select
Chip Select
Chip Select
Byte Write Inputs
Output Enable
Power Sleep Mode
Burst Mode Control
A
11
DQa
0
~a
8
DQb
0
~b
8
Data Inputs/Outputs
A
17
50
N.C.
N.C.
N.C.
V
DDQ
V
SSQ
N.C.
N.C.
DQb
8
DQb
7
V
SSQ
V
DDQ
DQb
6
DQb
5
V
SS
V
DD
V
DD
V
SS
DQb
4
DQb
3
V
DDQ
V
SSQ
DQb
2
DQb
1
DQb
0
N.C.
V
SSQ
V
DDQ
N.C.
N.C.
N.C.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
100 Pin TQFP
(20mm x 14mm)
K7M801825B(512Kx18)
A
10
N.C.
N.C.
V
DDQ
V
SSQ
N.C.
DQa
0
DQa
1
DQa
2
V
SSQ
V
DDQ
DQa
3
DQa
4
V
SS
V
SS
V
DD
ZZ
DQa
5
DQa
6
V
DDQ
V
SSQ
DQa
7
DQa
8
N.C.
N.C.
V
SSQ
V
DDQ
N.C.
N.C.
N.C.
V
DDQ
V
SSQ
Output Power Supply
(2.5V or 3.3V)
Output Ground
4,11,20,27,54,61,70,77
5,10,21,26,55,60,71,76
Notes :
1. The pin 84 is reserved for address bit for the 16Mb NtRAM.
2. A
0
and A
1
are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.
-5-
Nov. 2003
Rev 3.0
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