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74ABT125DB,112

产品描述buffers & line drivers quad buffer 3-S
产品类别逻辑    逻辑   
文件大小130KB,共17页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74ABT125DB,112概述

buffers & line drivers quad buffer 3-S

74ABT125DB,112规格参数

参数名称属性值
Brand NameNXP Semiconductor
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SSOP1
包装说明5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14
针数14
制造商包装代码SOT337-1
Reach Compliance Codecompliant
其他特性POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION
控制类型ENABLE LOW
系列ABT
JESD-30 代码R-PDSO-G14
JESD-609代码e4
长度6.2 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.064 A
湿度敏感等级1
位数1
功能数量4
端口数量2
端子数量14
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SSOP
封装等效代码SSOP14,.3
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
包装方法TUBE
峰值回流温度(摄氏度)260
电源5 V
最大电源电流(ICC)30 mA
Prop。Delay @ Nom-Sup4.9 ns
传播延迟(tpd)4.9 ns
认证状态Not Qualified
座面最大高度2 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层NICKEL PALLADIUM GOLD
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度5.3 mm
Base Number Matches1

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74ABT125
Quad buffer; 3-state
Rev. 6 — 3 November 2011
Product data sheet
1. General description
The 74ABT125 high-performance BiCMOS device combines low static and dynamic
power dissipation with high speed and high output drive.
The 74ABT125 device is a quad buffer that is ideal for driving bus lines. The device
features four Output Enables (1OE, 2OE, 3OE, 4OE), each controlling one of the 3-state
outputs.
2. Features and benefits
Quad bus interface
3-state buffers
Live insertion and extraction permitted
Output capability: HIGH
32
mA; LOW +64 mA
Power-up 3-state
Inputs are disabled during 3-state mode
Latch-up protection exceeds 500 mA per JESD78 class II level A
ESD protection:
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74ABT125N
74ABT125D
74ABT125DB
74ABT125PW
74ABT125BQ
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
40 C
to +85
C
Name
DIP14
SO14
SSOP14
TSSOP14
DHVQFN14
Description
plastic dual in-line package; 14 leads (300 mil)
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm
Version
SOT27-1
SOT108-1
SOT337-1
SOT402-1
SOT762-1
Type number

74ABT125DB,112相似产品对比

74ABT125DB,112 74ABT125PW,118 74ABT125PW,112 74ABT125D,602 74ABT125DB,118 74ABT125D,623
描述 buffers & line drivers quad buffer 3-S buffers & line drivers quad buffer 3-S buffers & line drivers quad buffer 3-S buffers & line drivers quad buffer 3state buffers & line drivers quad buffer 3-S buffers & line drivers quad buffer 3-S
Brand Name NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SSOP1 TSSOP TSSOP SOIC SSOP1 SOIC
包装说明 5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14 TSSOP, TSSOP14,.25 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14
针数 14 14 14 14 14 14
制造商包装代码 SOT337-1 SOT402-1 SOT402-1 SOT108-1 SOT337-1 SOT108-1
Reach Compliance Code compliant compliant compliant compliant compliant compliant
其他特性 POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION
控制类型 ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
系列 ABT ABT ABT ABT ABT ABT
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
长度 6.2 mm 5 mm 5 mm 8.65 mm 6.2 mm 8.65 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.064 A 0.064 A 0.064 A 0.064 A 0.064 A 0.064 A
湿度敏感等级 1 1 1 1 1 1
位数 1 1 1 1 1 1
功能数量 4 4 4 4 4 4
端口数量 2 2 2 2 2 2
端子数量 14 14 14 14 14 14
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP TSSOP TSSOP SOP SSOP SOP
封装等效代码 SSOP14,.3 TSSOP14,.25 TSSOP14,.25 SOP14,.25 SSOP14,.3 SOP14,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
包装方法 TUBE TAPE AND REEL TUBE TUBE TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 260 260 260 260 260
电源 5 V 5 V 5 V 5 V 5 V 5 V
最大电源电流(ICC) 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA
Prop。Delay @ Nom-Sup 4.9 ns 4.9 ns 4.9 ns 4.9 ns 4.9 ns 4.9 ns
传播延迟(tpd) 4.9 ns 4.9 ns 4.9 ns 4.9 ns 4.9 ns 4.9 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2 mm 1.1 mm 1.1 mm 1.75 mm 2 mm 1.75 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL PALLADIUM GOLD
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 1.27 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 5.3 mm 4.4 mm 4.4 mm 3.9 mm 5.3 mm 3.9 mm
Base Number Matches 1 1 1 1 1 1
JESD-609代码 e4 e4 e4 e4 - e4

 
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