buffers & line drivers quad buffer 3state
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOIC |
| 包装说明 | 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 |
| 针数 | 14 |
| 制造商包装代码 | SOT108-1 |
| Reach Compliance Code | compliant |
| 其他特性 | POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION |
| 控制类型 | ENABLE LOW |
| 系列 | ABT |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 8.65 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.064 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP14,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TUBE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 5 V |
| 最大电源电流(ICC) | 30 mA |
| Prop。Delay @ Nom-Sup | 4.9 ns |
| 传播延迟(tpd) | 4.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |

| 74ABT125D,602 | 74ABT125PW,118 | 74ABT125PW,112 | 74ABT125DB,112 | 74ABT125DB,118 | 74ABT125D,623 | |
|---|---|---|---|---|---|---|
| 描述 | buffers & line drivers quad buffer 3state | buffers & line drivers quad buffer 3-S | buffers & line drivers quad buffer 3-S | buffers & line drivers quad buffer 3-S | buffers & line drivers quad buffer 3-S | buffers & line drivers quad buffer 3-S |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SOIC | TSSOP | TSSOP | SSOP1 | SSOP1 | SOIC |
| 包装说明 | 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 | TSSOP, TSSOP14,.25 | 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 | 5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14 | 5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14 | 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 |
| 制造商包装代码 | SOT108-1 | SOT402-1 | SOT402-1 | SOT337-1 | SOT337-1 | SOT108-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION | POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION | POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION | POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION | POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION | POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 系列 | ABT | ABT | ABT | ABT | ABT | ABT |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 8.65 mm | 5 mm | 5 mm | 6.2 mm | 6.2 mm | 8.65 mm |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I(ol) | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | TSSOP | SSOP | SSOP | SOP |
| 封装等效代码 | SOP14,.25 | TSSOP14,.25 | TSSOP14,.25 | SSOP14,.3 | SSOP14,.3 | SOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
| 包装方法 | TUBE | TAPE AND REEL | TUBE | TUBE | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大电源电流(ICC) | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA |
| Prop。Delay @ Nom-Sup | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns |
| 传播延迟(tpd) | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.1 mm | 1.1 mm | 2 mm | 2 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 3.9 mm | 4.4 mm | 4.4 mm | 5.3 mm | 5.3 mm | 3.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e4 | e4 | e4 | e4 | - | e4 |
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