clock buffer pcie gen2 1:2 buffer
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Silicon Laboratories Inc |
零件包装代码 | DFN |
包装说明 | HVSON, SOLCC8,.06,16 |
针数 | 8 |
Reach Compliance Code | compli |
其他特性 | ALSO OPERATES AT 3.3 V SUPPLY |
系列 | 53102 |
输入调节 | DIFFERENTIAL |
JESD-30 代码 | R-PDSO-N8 |
长度 | 1.6 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
功能数量 | 1 |
反相输出次数 | |
端子数量 | 8 |
实输出次数 | 4 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装等效代码 | SOLCC8,.06,16 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
电源 | 2.5/3.3 V |
认证状态 | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.1 ns |
座面最大高度 | 0.8 mm |
最大供电电压 (Vsup) | 2.75 V |
最小供电电压 (Vsup) | 2.25 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子形式 | NO LEAD |
端子节距 | 0.4 mm |
端子位置 | DUAL |
宽度 | 1.4 mm |
Si53102-A2-GM | SI53102-A3-GMR | SI53102-A1-GMR | SI53102-A1-GM | |
---|---|---|---|---|
描述 | clock buffer pcie gen2 1:2 buffer | IC CLK BUFFER PCIE 1:2 8TDFN | IC CLK BUFFER PCIE 1:2 8TDFN | IC CLK BUFFER PCIE 1:2 8TDFN |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc |
零件包装代码 | DFN | DFN | DFN | DFN |
包装说明 | HVSON, SOLCC8,.06,16 | TDFN-8 | TDFN-8 | TDFN-8 |
针数 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compli | compliant | compliant | compliant |
其他特性 | ALSO OPERATES AT 3.3 V SUPPLY | ALSO OPERATES AT 3.3 V SUPPLY | ALSO OPERATES AT 3.3 V SUPPLY | ALSO OPERATES AT 3.3 V SUPPLY |
系列 | 53102 | 53102 | 53102 | 53102 |
输入调节 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
长度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 |
实输出次数 | 4 | 4 | 4 | 4 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVSON | HVSON | HVSON | HVSON |
封装等效代码 | SOLCC8,.06,16 | SOLCC8,.06,16 | SOLCC8,.06,16 | SOLCC8,.06,16 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.1 ns | 0.1 ns | 0.1 ns | 0.1 ns |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
最大供电电压 (Vsup) | 2.75 V | 2.75 V | 2.75 V | 2.75 V |
最小供电电压 (Vsup) | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
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