digital to analog converters - dac 8-bit precision dac
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.4 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 长度 | 10.3 mm |
| 最大线性误差 (EL) | 0.0488% |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大稳定时间 | 0.2 µs |
| 最大压摆率 | 0.1 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| MX7523LCWE+ | MX7523JCWE+ | MX7523JN+ | MX7523KN+ | MX7523KCWE+ | MX7523JEWE+ | MX7523JEWE+T | |
|---|---|---|---|---|---|---|---|
| 描述 | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SOIC | SOIC | DIP | DIP | SOIC | SOIC | SOIC |
| 包装说明 | SOP, SOP16,.4 | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOP, SOP16,.4 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 最大线性误差 (EL) | 0.0488% | 0.1953% | 0.1953% | 0.0977% | 0.0977% | 0.2% | 0.2% |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP | DIP | SOP | SOP | SOP |
| 封装等效代码 | SOP16,.4 | SOP16,.4 | DIP16,.3 | DIP16,.3 | SOP16,.4 | SOP16,.4 | SOP16,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大稳定时间 | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs |
| 最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 1 week | 12 weeks | 13 weeks | 13 weeks | - | 1 week | - |
| 输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | - | - |
| 长度 | 10.3 mm | 10.3 mm | 19.175 mm | 19.175 mm | 10.3 mm | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 座面最大高度 | 2.65 mm | 2.65 mm | 4.572 mm | 4.572 mm | 2.65 mm | - | - |
| 宽度 | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm | - | - |
嵌入式系统
电源技术
FPGA/CPLD
DIY/开源硬件专区
工业自动化与控制
微控制器 MCU
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