multiplexer switch ics 2:1 1ch/4:1 2ch mux
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP14,.25 |
| 针数 | 14 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 其他特性 | CAN ALSO OPERATE WITH SINGLE 12V SUPPLY |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e3 |
| 长度 | 8.65 mm |
| 湿度敏感等级 | 1 |
| 负电源电压最大值（Vsup） | -20 V |
| 负电源电压最小值（Vsup） | -4.5 V |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 标称断态隔离度 | 62 dB |
| 通态电阻匹配规范 | 2 Ω |
| 最大通态电阻 (Ron) | 400 Ω |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP14,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 12/+-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大信号电流 | 0.03 A |
| 最大供电电流 (Isup) | 0.375 mA |
| 最大供电电压 (Vsup) | 20 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 200 ns |
| 最长接通时间 | 275 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| MAX4534CSD+ | MAX4534EUD+T | MAX4535EPD+ | MAX4535ESD+ | MAX4534EUD+ | MAX4534CSD+T | MAX4535CUD+T | |
|---|---|---|---|---|---|---|---|
| 描述 | multiplexer switch ics 2:1 1ch/4:1 2ch mux | multiplexer switch ics 2:1 1ch/4:1 2ch mux | multiplexer switch ics 2:1 1ch/4:1 2ch mux | multiplexer switch ics 2:1 1ch/4:1 2ch mux | multiplexer switch ics 2:1 1ch/4:1 2ch mux | multiplexer switch ics 2:1 1ch/4:1 2ch mux | multiplexer switch ics 2:1 1ch/4:1 2ch mux |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | SOP, SOP14,.25 | TSSOP, TSSOP14,.25 | DIP, | SOP, | TSSOP, TSSOP14,.25 | SOP, SOP14,.25 | , |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 零件包装代码 | SOIC | TSSOP | DIP | SOIC | TSSOP | SOIC | - |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 6 weeks | 4 weeks | - | 6 weeks | 6 weeks | 4 weeks | 6 weeks |
| 其他特性 | CAN ALSO OPERATE WITH SINGLE 12V SUPPLY | CAN ALSO OPERATE WITH SINGLE 12V SUPPLY | CAN ALSO OPERATE WITH SINGLE 12V SUPPLY | CAN ALSO OPERATE WITH SINGLE 12V SUPPLY | CAN ALSO OPERATE WITH SINGLE 12V SUPPLY | CAN ALSO OPERATE WITH SINGLE 12V SUPPLY | - |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | - |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | - |
| 长度 | 8.65 mm | 5 mm | 19.05 mm | 8.65 mm | 5 mm | 8.65 mm | - |
| 负电源电压最大值（Vsup） | -20 V | -20 V | -20 V | -20 V | -20 V | -20 V | - |
| 负电源电压最小值（Vsup） | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | - |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | - |
| 信道数量 | 4 | 4 | 2 | 2 | 4 | 4 | - |
| 功能数量 | 1 | 1 | 2 | 2 | 1 | 1 | - |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | - |
| 标称断态隔离度 | 62 dB | 62 dB | 62 dB | 62 dB | 62 dB | 62 dB | - |
| 通态电阻匹配规范 | 2 Ω | 2 Ω | 2 Ω | 2 Ω | 2 Ω | 2 Ω | - |
| 最大通态电阻 (Ron) | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω | - |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | TSSOP | DIP | SOP | TSSOP | SOP | - |
| 封装等效代码 | SOP14,.25 | TSSOP14,.25 | - | - | TSSOP14,.25 | SOP14,.25 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - |
| 电源 | 12/+-15 V | 12/+-15 V | - | - | 12/+-15 V | 12/+-15 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.75 mm | 1.1 mm | 4.572 mm | 1.75 mm | 1.1 mm | 1.75 mm | - |
| 最大信号电流 | 0.03 A | 0.03 A | - | - | 0.03 A | 0.03 A | - |
| 最大供电电流 (Isup) | 0.375 mA | 0.375 mA | - | - | 0.375 mA | 0.375 mA | - |
| 最大供电电压 (Vsup) | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | - |
| 表面贴装 | YES | YES | NO | YES | YES | YES | - |
| 最长断开时间 | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | - |
| 最长接通时间 | 275 ns | 275 ns | 275 ns | 275 ns | 275 ns | 275 ns | - |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - |
| 技术 | CMOS | CMOS | - | - | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm | 0.65 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 宽度 | 3.9 mm | 4.4 mm | 7.62 mm | 3.9 mm | 4.4 mm | 3.9 mm | - |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
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