Si3216
P
RO
SLIC
®
P
R O GRA MM A B LE
W
IDEBAND
SLIC/C
ODEC
W I T H
R
INGING
/ B
A TT E R Y
V
OLTA GE
G
ENERATION
Features
Dual-mode wideband (50 Hz to 7 kHz)/
narrowband (200 Hz to 3.4 kHz) codec with
16-bit 16 kHz sampling for enhanced audio
quality
Performs all BORSCHT functions
Ideal for customer premise equipment
applications
Software-programmable internal ringing up
to 90 V
PK
Integrated battery supply with dynamic
voltage output
On-chip dc-dc converter continuously
minimizes power in all operating modes
Entire solution can be powered from a
single 3.3 V or 5 V supply
3.3 V to 35 V dc input range
Dynamic 0 V to –94.5 V output
Low-cost inductor and high-efficiency
transformer versions supported
Software-programmable features and
parameters:
Ringing frequency, amplitude, cadence,
and waveshape
2-wire ac impedance and hybrid
Constant current feed (20 to 41 mA)
Loop closure and ring trip thresholds
Applications
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Software programmable signal
generation and audio processing:
µ-law/A-law
FSK
Ordering Information
See page 114.
Voice-over-broadband systems:
DSL, cable, wireless
PBX/IP-PBX/key telephone systems
Terminal adapters: ISDN, Ethernet, USB
Description
The Si3216
is a low-voltage CMOS device that provides a complete analog
telephone interface supporting both wideband (50 Hz to 7.0 kHz) and narrowband
(200 Hz to 3.4 kHz) audio codec modes for enhanced voice quality in Voice-over-IP
(VoIP) applications. The ProSLIC integrates subscriber line interface circuit (SLIC),
wideband voice codec, and battery generation functionality into a single fully-
programmable device for global operation using only one hardware solution. The
Si3216’s wideband codec provides expanded audio band (50 Hz to 7 kHz), 16 kHz
sampling rate, and increased dynamic range for improved audio quality over traditional
telephony codecs. The integrated battery supply continuously adapts its output voltage
to minimize power and enables the entire solution to be powered from a single 3.3 V
(Si3216M only) or 5 V supply. Si3216 features include software-configurable 5 REN
internal ringing up to 90 V
PK
, DTMF and caller ID generation, and a comprehensive set
of telephony signaling capabilities including expanded support of Japan and China
country requirements. The ProSLIC is packaged in a 38-pin QFN and TSSOP, and the
Si3201 high-voltage line interface device is packaged in a thermally-enhanced 16-pin
SOIC.
ProSLIC
®
DTX
FSYNC
RESET
SDCH
SDCL
V
DDA1
IREF
CAPP
QGND
CAPM
STIPDC
SRINGDC
1 38 37 36 35 34 33 32 31
2
3
4
5
6
7
8
9
30
29
28
27
26
25
24
23
22
21
DRX
PCLK
INT
CS
SCLK
SDI
SDO
SDITHRU
DCDRV
DCFF
TEST
GNDD
VDDD
ITIPN
ITIPP
V
DDA2
IRINGP
IRINGN
IGMP
companding
(caller ID) generation
Dual audio tone generators
Smooth and abrupt polarity reversal
100% software-configurable global
solution
Audio loopback, dc, and GR-909
subscriber line diagnostic capabilities
Lead-free and RoHS-compliant packages
available
Pin Assignments
Si3216
QFN
10
11
12 13 14 15 16 17 18 19 20
U.S. Patent #6,567,521
U.S. Patent #6,812,744
Other patents pending
Functional Block Diagram
INT
RESET
Si3216
Line
Status
Compression
CS
SCLK
SDO
SDI
DTX
Control
Interface
TIP
Dual-Mode
Wideband/
Narrowband
Codec
Linefeed
Control
Linefeed
Interface
RING
DRX
Expansion
PCM
Interface
Tone
Generation
Prog.
Hybrid
Z
S
FSYNC
DC-DC Converter Controller
PCLK
PLL
Discrete
Components
Rev. 1.0 12/08
Copyright © 2008 by Silicon Laboratories
STIPE
SVBAT
SRINGE
STIPAC
RINGAC
IGMN
GNDA
Si3216
2
Si3216
Rev. 1.0
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Si3216
T
ABLE
Section
OF
C
ONTENTS
Page
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Rev. 1.0
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.1. Linefeed Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.2. Battery Voltage Generation and Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.3. Tone Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.4. Ringing Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.5. Audio Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.6. Two-Wire Impedance Matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2.7. Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.8. Interrupt Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.9. Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.10. PCM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
4. Indirect Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
4.1. Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
4.2. Digital Programmable Gain/Attenuation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
4.3. SLIC Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
4.4. FSK Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109
5. Pin Descriptions: Si3216 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
6. Pin Descriptions: Si3201 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
7. Ordering Guides . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
8. Package Outline: 38-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
9. Package Outline: 38-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
10. Package Outline: 16-Pin ESOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
11. Silicon Labs Si3216 Support Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122
3
Si3216
1. Electrical Specifications
Table 1. Absolute Maximum Ratings and Thermal Information
1
Parameter
Symbol
Si3216
DC Supply Voltage
Input Current, Digital Input Pins
Digital Input Voltage
Operating Temperature Range
2
Storage Temperature Range
V
DDD
, V
DDA1
, V
DDA2
I
IN
V
IND
T
A
T
STG
JA
JA
P
D
–0.5 to 6.0
±10
–0.3 to (V
DDD
+ 0.3)
–40 to 100
–40 to 150
70
35
V
mA
V
C
C
C/W
C/W
W
Value
Unit
TSSOP-38 Thermal Resistance, Typical
QFN-38 Thermal Resistance, Typical
Continuous Power Dissipation
2
DC Supply Voltage
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0.7
Si3201
V
DD
V
BAT
V
IN
T
A
–104
V
INHV
T
STG
JA
P
D
55
Rev. 1.0
–0.5 to 6.0
V
V
V
V
C
C
C/W
W
Battery Supply Voltage
Input Voltage: TIP, RING, SRINGE, STIPE pins
Operating Temperature Range
2
Storage Temperature Range
(V
BAT
– 0.3) to (V
DD
+ 0.3)
–0.3 to (V
DD
+ 0.3)
–40 to 100
–40 to 150
Input Voltage: ITIPP, ITIPN, IRINGP, IRINGN pins
SOIC-16 Thermal Resistance, Typical
3
Continuous Power Dissipation
2
0.8 at 70 ºC
0.6 at 85 ºC
Notes:
1.
Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2.
Operation above 125
º
C junction temperature may degrade device reliability.
3.
Thermal resistance assumes a multi-layer PCB with the exposed pad soldered to a topside PCB pad.
4
Si3216
Table 2. Recommended Operating Conditions
Parameter
Ambient Temperature
Ambient Temperature
Si3216 Supply Voltage
Si3201 Supply Voltage
Si3201 Battery Voltage
Symbol
T
A
T
A
V
DDD
,V
DDA1
,
V
DDA2
V
DD
V
BAT
V
BATH
= V
BAT
Test Condition
K-grade
B-grade
Min*
0
–40
3.13
3.13
–96
Typ
25
25
3.3/5.0
3.3/5.0
—
Max*
70
85
5.25
5.25
–10
Unit
o
C
o
C
V
V
V
*Note:
All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25
º
C unless otherwise stated.
Product specifications are only guaranteed when the typical application circuit (including component tolerances) is
used.
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Rev. 1.0
5
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