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MAX15013CASA+

产品描述gate drivers 175v/2A high-speed half-B mosfet drvr
产品类别模拟混合信号IC    驱动程序和接口   
文件大小365KB,共18页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX15013CASA+概述

gate drivers 175v/2A high-speed half-B mosfet drvr

MAX15013CASA+规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Maxim(美信半导体)
零件包装代码SOIC
包装说明HLSOP, SOP8,.25
针数8
Reach Compliance Codecompli
ECCN代码EAR99
Factory Lead Time15 weeks
高边驱动器YES
接口集成电路类型HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码R-PDSO-G8
JESD-609代码e3
长度4.89 mm
湿度敏感等级1
功能数量1
端子数量8
最高工作温度125 °C
最低工作温度-40 °C
标称输出峰值电流2 A
封装主体材料PLASTIC/EPOXY
封装代码HLSOP
封装等效代码SOP8,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
峰值回流温度(摄氏度)260
电源8/12 V
认证状态Not Qualified
座面最大高度1.68 mm
最大供电电压12.6 V
最小供电电压8 V
标称供电电压12 V
表面贴装YES
技术BICMOS
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
断开时间63 µs
接通时间63 µs
宽度3.9 mm

文档预览

下载PDF文档
19-0530; Rev 1; 12/07
175V/2A, High-Speed,
Half-Bridge MOSFET Drivers
General Description
The MAX15012/MAX15013 high-frequency, 175V half-
bridge, n-channel MOSFET drivers drive high- and low-
side MOSFETs in high-voltage applications. These
drivers are independently controlled and their 35ns typ-
ical propagation delay, from input to output, are
matched to within 2ns (typ). The high-voltage operation
with very low and matched propagation delay between
drivers, and high source/sink current capabilities make
these devices suitable for the high-power, high-fre-
quency telecom power converters. A reliable on-chip
bootstrap diode connected between V
DD
and BST
eliminates the need for an external discrete diode.
The MAX15012A/C and MAX15013A/C offer both nonin-
verting drivers (see the
Selector Guide).
The
MAX15012B/D and MAX15013B/D offer a noninverting
high-side driver and an inverting low-side driver. The
MAX15012A/B/C/D feature CMOS (V
DD
/2) logic inputs.
The MAX15013A/B/C/D feature TTL logic inputs. The
drivers are available in the industry-standard 8-pin SO
footprint and pin configuration and a thermally
enhanced 8-pin SO package. All devices operate over
the -40°C to +125°C automotive temperature range.
Features
HIP2100/HIP2101 Pin Compatible (MAX15012A/C
and MAX15013A/C)
Up to 175V Input Operation
8V to 12.6V V
DD
Input Voltage Range
2A Peak Source and Sink Current Drive Capability
35ns Typical Propagation Delay
Guaranteed 8ns Propagation Delay Matching
Between Drivers
Up to 500kHz Switching Frequency
Available in CMOS (V
DD
/2) or TTL Logic-Level
Inputs with Hysteresis
Up to 14V Logic Inputs Independent of Input
Voltage
Low 2.5pF Input Capacitance
Low 70µA Supply Current
Versions Available with Combination of
Noninverting and Inverting Drivers (MAX15012B/D
and MAX15013B/D)
Available in Industry-Standard 8-Pin SO and
Thermally Enhanced SO Packages
MAX15012/MAX15013
Applications
Telecom Half-Bridge Power Supplies
Two-Switch Forward Converters
Full-Bridge Converters
Active-Clamp Forward Converters
Power-Supply Modules
Motor Control
Pin Configurations and Typical Operating Circuit appear at
the end of data sheet.
PART
MAX15012AASA+
MAX15012BASA+
MAX15012CASA+*
MAX15012DASA+*
Ordering Information
TEMP RANGE
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
PIN-
PACKAGE
8 SO
8 SO
8 SO-EP**
8 SO-EP**
PKG
CODE
S8-5
S8-5
S8E+14
S8E+14
Ordering Information continued at end of data sheet.
+Denotes
lead-free package.
*Future
product—contact factory for availability.
**EP
= Exposed pad.
Selector Guide
PART
MAX15012AASA+
MAX15012BASA+
MAX15012CASA+
MAX15012DASA+
MAX15013AASA+
MAX15013BASA+
MAX15013CASA+
MAX15013DASA+
HIGH-SIDE DRIVER
Noninverting
Noninverting
Noninverting
Noninverting
Noninverting
Noninverting
Noninverting
Noninverting
LOW-SIDE DRIVER
Noninverting
Inverting
Noninverting
Inverting
Noninverting
Inverting
Noninverting
Inverting
LOGIC LEVELS
CMOS (V
DD
/2)
CMOS (V
DD
/2)
CMOS (V
DD
/2)
CMOS (V
DD
/2)
TTL
TTL
TTL
TTL
PIN COMPATIBLE
HIP 2100IB
HIP 2100IB
HIP 2101IB
HIP 2101IB
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

MAX15013CASA+相似产品对比

MAX15013CASA+ MAX15012DASA+ MAX15013CASA+T MAX15013AASA+T MAX15012AASA+T MAX15012CASA+ MAX15013DASA+T MAX15012BASA+T
描述 gate drivers 175v/2A high-speed half-B mosfet drvr gate drivers 175v/2A high-speed half-B mosfet drvr gate drivers 175v/2A high-speed half-B mosfet drvr gate drivers 175v/2A high-speed half-B mosfet drvr gate drivers 175v/2A high-speed half-B mosfet drvr gate drivers 175v/2A high-speed half-B mosfet drvr gate drivers 175v/2A high-speed half-B mosfet drvr gate drivers 175v/2A high-speed half-B mosfet drvr
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
Reach Compliance Code compli compli compli compli compli compli compli compli
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
接口集成电路类型 HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
峰值回流温度(摄氏度) 260 260 NOT SPECIFIED 260 260 260 NOT SPECIFIED 260
处于峰值回流温度下的最长时间 30 NOT SPECIFIED NOT SPECIFIED 30 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) - - Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 SOIC SOIC - SOIC SOIC SOIC - SOIC
包装说明 HLSOP, SOP8,.25 HLSOP, SOP8,.25 , SOP, SOP8,.25 SOP, SOP8,.25 HLSOP, SOP8,.25 - SOP, SOP8,.25
针数 8 8 - 8 8 8 - 8
Factory Lead Time 15 weeks 6 weeks 15 weeks 17 weeks 6 weeks 6 weeks - -
高边驱动器 YES YES - YES YES YES - YES
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 - R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 - R-PDSO-G8
JESD-609代码 e3 e3 e3 e3 e3 e3 - e3
长度 4.89 mm 4.89 mm - 4.9 mm 4.9 mm 4.89 mm - 4.9 mm
湿度敏感等级 1 1 1 1 1 1 - 1
功能数量 1 1 - 1 1 1 - 1
端子数量 8 8 - 8 8 8 - 8
最高工作温度 125 °C 125 °C - 125 °C 125 °C 125 °C - 125 °C
最低工作温度 -40 °C -40 °C - -40 °C -40 °C -40 °C - -40 °C
标称输出峰值电流 2 A 2 A - 2 A 2 A 2 A - 2 A
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 HLSOP HLSOP - SOP SOP HLSOP - SOP
封装等效代码 SOP8,.25 SOP8,.25 - SOP8,.25 SOP8,.25 SOP8,.25 - SOP8,.25
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE - SMALL OUTLINE
电源 8/12 V 8/12 V - 8/12 V 8/12 V 8/12 V - 8/12 V
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified
座面最大高度 1.68 mm 1.68 mm - 1.75 mm 1.75 mm 1.68 mm - 1.75 mm
最大供电电压 12.6 V 12.6 V - 12.6 V 12.6 V 12.6 V - 12.6 V
最小供电电压 8 V 8 V - 8 V 8 V 8 V - 8 V
标称供电电压 12 V 12 V - 12 V 12 V 12 V - 12 V
表面贴装 YES YES - YES YES YES - YES
技术 BICMOS BICMOS - BICMOS BICMOS BICMOS - BICMOS
温度等级 AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn)
端子形式 GULL WING GULL WING - GULL WING GULL WING GULL WING - GULL WING
端子节距 1.27 mm 1.27 mm - 1.27 mm 1.27 mm 1.27 mm - 1.27 mm
端子位置 DUAL DUAL - DUAL DUAL DUAL - DUAL
断开时间 63 µs 63 µs - 63 µs 63 µs 63 µs - 63 µs
接通时间 63 µs 63 µs - 63 µs 63 µs 63 µs - 63 µs
宽度 3.9 mm 3.9 mm - 3.9 mm 3.9 mm 3.9 mm - 3.9 mm

 
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