
eeprom 16k 2048 X 8 2.5V serial EE ind
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 5 weeks |
| 最大时钟频率 (fCLK) | 1 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e3 |
| 长度 | 9.271 mm |
| 内存密度 | 16384 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | SERIAL |
| 峰值回流温度(摄氏度) | NOT APPLICABLE |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.334 mm |
| 串行总线类型 | 1-WIRE |
| 最大待机电流 | 0.000005 A |
| 最大压摆率 | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE |
| 宽度 | 7.62 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| 写保护 | SOFTWARE |
| Base Number Matches | 1 |

| 11LC161-I/P | 11AA161-I/P | AP2318AGEN-HF_14 | 11AA02UIDT-I/TT | 11AA161-I/TO | 11AA161T-I/TT | PT7V4050GACCB20.480/20.6208 | 11LC161-E/MS | 11LC161T-E/MS | 11AA02UID-I/SN | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | eeprom 16k 2048 X 8 2.5V serial EE ind | eeprom 16k 2048 X 8 1.8V serial EE ind | Small Outline Package | eeprom 2K uni/O EE unique ID upper quarter S/W | eeprom 16k 2048 X 8 1.8V serial EE ind | eeprom 16k 2048 X 8 1.8V serial EE ind | PLL/Frequency Synthesis Circuit, | eeprom 16k 2048 X 8 2.5V serial EE ext | eeprom 16k 2048 X 8 2.5V serial EE ext | eeprom 2K uni/O EE unique ID upper quarter S/W |
| 是否无铅 | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | DIP | - | - | TO-92 | SOT-23 | - | MSOP | MSOP | - |
| 包装说明 | DIP, DIP8,.3 | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | - | SOT-23, 3 PIN | ROHS COMPLIANT, PLASTIC, TO-92, 3 PIN | ROHS COMPLIANT, PLASTIC, SOT-23, 3 PIN | , | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | SOIC-8 |
| 针数 | 8 | 8 | - | - | 3 | 3 | - | 8 | 8 | - |
| Reach Compliance Code | compli | compli | - | compli | compli | compli | unknown | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 5 weeks | 5 weeks | - | 15 weeks | - | 6 weeks | - | 8 weeks | - | 10 weeks |
| 最大时钟频率 (fCLK) | 1 MHz | 1 MHz | - | 0.1 MHz | 1 MHz | 1 MHz | - | 1 MHz | 1 MHz | 0.1 MHz |
| 数据保留时间-最小值 | 200 | 200 | - | - | 200 | 200 | - | 200 | 200 | - |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - |
| JESD-30 代码 | R-PDIP-T8 | R-PDIP-T8 | - | R-PDSO-G3 | X-PBCY-T3 | R-PDSO-G3 | - | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | - | e3 | e3 | e3 | - | e3 | e3 | e3 |
| 长度 | 9.271 mm | 9.271 mm | - | 2.9 mm | - | 2.9 mm | - | 3 mm | 3 mm | 4.9 mm |
| 内存密度 | 16384 bi | 16384 bi | - | 2048 bi | 16384 bi | 16384 bi | - | 16384 bit | 16384 bit | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | - | 8 | 8 | 8 | - | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | - | 3 | 3 | 3 | - | 8 | 8 | 8 |
| 字数 | 2048 words | 2048 words | - | 256 words | 2048 words | 2048 words | - | 2048 words | 2048 words | 256 words |
| 字数代码 | 2000 | 2000 | - | 256 | 2000 | 2000 | - | 2000 | 2000 | 256 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | - | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 组织 | 2KX8 | 2KX8 | - | 256X8 | 2KX8 | 2KX8 | - | 2KX8 | 2KX8 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | - | SOP | TO-92 | TSSOP | - | TSSOP | TSSOP | SOP |
| 封装等效代码 | DIP8,.3 | DIP8,.3 | - | - | SIP3,.1,50 | TO-236 | - | TSSOP8,.19 | TSSOP8,.19 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | UNSPECIFIED | RECTANGULAR | - | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | - | SMALL OUTLINE | CYLINDRICAL | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL |
| 峰值回流温度(摄氏度) | NOT APPLICABLE | NOT SPECIFIED | - | 260 | NOT SPECIFIED | 260 | - | 260 | 260 | 260 |
| 电源 | 3/5 V | 2/5 V | - | - | 2/5 V | 2/5 V | - | 3/5 V | 3/5 V | - |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | 5.334 mm | 5.334 mm | - | 1.12 mm | - | 1.12 mm | - | 1.1 mm | 1.1 mm | 1.75 mm |
| 串行总线类型 | 1-WIRE | 1-WIRE | - | SPI | 1-WIRE | 1-WIRE | - | 1-WIRE | 1-WIRE | SPI |
| 最大待机电流 | 0.000005 A | 0.000005 A | - | - | 0.000005 A | 0.000005 A | - | 0.000005 A | 0.000005 A | - |
| 最大压摆率 | 0.005 mA | 0.005 mA | - | - | 0.005 mA | 0.005 mA | - | 0.005 mA | 0.005 mA | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | - | 2.5 V | 2.5 V | 1.8 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | - | YES | NO | YES | - | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | - | 0.95 mm | 1.27 mm | 0.95 mm | - | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | BOTTOM | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE | NOT SPECIFIED | - | 40 | NOT SPECIFIED | 40 | - | 40 | 40 | 40 |
| 宽度 | 7.62 mm | 7.62 mm | - | 1.3 mm | - | 1.3 mm | - | 3 mm | 3 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | - | 5 ms | 10 ms | 10 ms | - | 10 ms | 10 ms | 5 ms |
| 写保护 | SOFTWARE | SOFTWARE | - | - | SOFTWARE | SOFTWARE | - | SOFTWARE | SOFTWARE | - |
| Base Number Matches | 1 | 1 | - | - | 1 | 1 | - | 1 | 1 | - |
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