lin transceivers lin transceiver + 5.0V ldo + wwdt
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | HVQCCN, |
Reach Compliance Code | compliant |
Factory Lead Time | 28 weeks |
JESD-30 代码 | S-PQCC-N20 |
JESD-609代码 | e3 |
长度 | 5 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
筛选级别 | TS 16949 |
座面最大高度 | 1 mm |
标称供电电压 | 12 V |
表面贴装 | YES |
电信集成电路类型 | INTERFACE CIRCUIT |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 5 mm |
Base Number Matches | 1 |
MCP2050-500E/MQ | MCP2050-330E/MQ | MCP2050-E/MQ | MCP2050-E/P | MCP2050T-E/MQ | MCP2050-E/SL | MCP2050T-E/SL | |
---|---|---|---|---|---|---|---|
描述 | lin transceivers lin transceiver + 5.0V ldo + wwdt | lin transceivers lin transceiver + 3.3V ldo + wwdt | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | DIP, | HVQCCN, | SOP, | SOP, |
Reach Compliance Code | compliant | compliant | compli | compli | compli | compli | compli |
JESD-30 代码 | S-PQCC-N20 | S-PQCC-N20 | S-PQCC-N20 | R-PDIP-T14 | S-PQCC-N20 | R-PDSO-G14 | R-PDSO-G14 |
长度 | 5 mm | 5 mm | 5 mm | 19.05 mm | 5 mm | 8.65 mm | 8.65 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 14 | 20 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | DIP | HVQCCN | SOP | SOP |
封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
筛选级别 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 |
座面最大高度 | 1 mm | 1 mm | 1 mm | 5.334 mm | 1 mm | 1.75 mm | 1.75 mm |
标称供电电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
表面贴装 | YES | YES | YES | NO | YES | YES | YES |
电信集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 0.65 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | DUAL | QUAD | DUAL | DUAL |
宽度 | 5 mm | 5 mm | 5 mm | 7.62 mm | 5 mm | 3.9 mm | 3.9 mm |
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