DATACOM, INTERFACE CIRCUIT
参数名称 | 属性值 |
厂商名称 | Microchip(微芯科技) |
包装说明 | DIP, |
Reach Compliance Code | compli |
JESD-30 代码 | R-PDIP-T14 |
长度 | 19.05 mm |
功能数量 | 1 |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
筛选级别 | TS 16949 |
座面最大高度 | 5.334 mm |
标称供电电压 | 12 V |
表面贴装 | NO |
电信集成电路类型 | INTERFACE CIRCUIT |
温度等级 | AUTOMOTIVE |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
MCP2050-E/P | MCP2050-330E/MQ | MCP2050-500E/MQ | MCP2050-E/MQ | MCP2050T-E/MQ | MCP2050-E/SL | MCP2050T-E/SL | |
---|---|---|---|---|---|---|---|
描述 | DATACOM, INTERFACE CIRCUIT | lin transceivers lin transceiver + 3.3V ldo + wwdt | lin transceivers lin transceiver + 5.0V ldo + wwdt | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT | DATACOM, INTERFACE CIRCUIT |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | DIP, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | SOP, | SOP, |
Reach Compliance Code | compli | compliant | compliant | compli | compli | compli | compli |
JESD-30 代码 | R-PDIP-T14 | S-PQCC-N20 | S-PQCC-N20 | S-PQCC-N20 | S-PQCC-N20 | R-PDSO-G14 | R-PDSO-G14 |
长度 | 19.05 mm | 5 mm | 5 mm | 5 mm | 5 mm | 8.65 mm | 8.65 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 20 | 20 | 20 | 20 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | HVQCCN | HVQCCN | HVQCCN | HVQCCN | SOP | SOP |
封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
筛选级别 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 |
座面最大高度 | 5.334 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1.75 mm | 1.75 mm |
标称供电电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
表面贴装 | NO | YES | YES | YES | YES | YES | YES |
电信集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING |
端子节距 | 2.54 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL |
宽度 | 7.62 mm | 5 mm | 5 mm | 5 mm | 5 mm | 3.9 mm | 3.9 mm |
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