digital to analog converters - dac 8-bit precision dac
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP18,.3 |
| 针数 | 18 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 13 weeks |
| Samacsys Descripti | 8-bit DAC |
| 最大模拟输出电压 | 10 V |
| 最小模拟输出电压 | |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | OFFSET BINARY |
| 输入格式 | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDIP-T18 |
| JESD-609代码 | e3 |
| 长度 | 22.86 mm |
| 最大线性误差 (EL) | 0.1953% |
| 湿度敏感等级 | 1 |
| 标称负供电电压 | -5 V |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 12/15, GND/-5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大稳定时间 | 5 µs |
| 标称安定时间 (tstl) | 2 µs |
| 最大压摆率 | 6 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MX7224LN+ | MX7224LCWN+ | MX7224KP+ | MX7224KP+T | MX7224LP+ | MX7224KEWN+T | |
|---|---|---|---|---|---|---|
| 描述 | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac | digital to analog converters - dac 8-bit precision dac |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | DIP | SOIC | QLCC | QLCC | QLCC | SOIC |
| 包装说明 | DIP, DIP18,.3 | SOP, SOP18,.4 | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ | SOP, |
| 针数 | 18 | 18 | 20 | 20 | 20 | 18 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| 最大模拟输出电压 | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
| 输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDIP-T18 | R-PDSO-G18 | S-PQCC-J20 | S-PQCC-J20 | S-PQCC-J20 | R-PDSO-G18 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 22.86 mm | 11.55 mm | 8.965 mm | 8.965 mm | 8.965 mm | 11.55 mm |
| 最大线性误差 (EL) | 0.1953% | 0.1953% | 0.3906% | 0.3906% | 0.1953% | 0.3906% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 标称负供电电压 | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 20 | 20 | 20 | 18 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | QCCJ | QCCJ | QCCJ | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 2.65 mm | 4.57 mm | 4.57 mm | 4.57 mm | 2.65 mm |
| 标称安定时间 (tstl) | 2 µs | 2 µs | 2 µs | 2 µs | 2 µs | 2 µs |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | GULL WING | J BEND | J BEND | J BEND | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.5 mm | 8.965 mm | 8.965 mm | 8.965 mm | 7.5 mm |
| Factory Lead Time | 13 weeks | 15 weeks | 13 weeks | - | 12 weeks | 16 weeks |
| 封装等效代码 | DIP18,.3 | SOP18,.4 | LDCC20,.4SQ | LDCC20,.4SQ | LDCC20,.4SQ | - |
| 电源 | 12/15, GND/-5 V | 12/15, GND/-5 V | 12/15, GND/-5 V | 12/15, GND/-5 V | 12/15, GND/-5 V | - |
| 最大稳定时间 | 5 µs | 5 µs | 5 µs | 5 µs | 5 µs | - |
| 最大压摆率 | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA | - |
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