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IS43LD16640A-3BLI

产品描述dram 1G 1.2/1.8V 64mx16 333mhz 134ball bga
产品类别半导体    其他集成电路(IC)   
文件大小6MB,共143页
制造商All Sensors
标准
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IS43LD16640A-3BLI概述

dram 1G 1.2/1.8V 64mx16 333mhz 134ball bga

IS43LD16640A-3BLI规格参数

参数名称属性值
ManufactureISSI
产品种类
Product Category
DRAM
RoHSYes
Data Bus Width16 bi
Organizati64 M x 16
封装 / 箱体
Package / Case
BGA-134
Memory Size1 Gbi
Maximum Clock Frequency333 MHz
电源电压-最大
Supply Voltage - Max
1.3 V
Supply Voltage - Mi1.14 V
Maximum Operating Curre40 mA
最大工作温度
Maximum Operating Temperature
+ 85 C
最小工作温度
Minimum Operating Temperature
- 40 C
安装风格
Mounting Style
SMD/SMT

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IS43/46LD16640A
IS43/46LD32320A
1Gb (x16, x32) Mobile LpddR2 s4 sdRAM
FeAtURes
Low-voltage Core and I/O Power Supplies
VDD2 = 1.14-1.30V, VDDCA/VDDQ = 1.14-1.30V,
VDD1 = 1.70-1.95V
High Speed Un-terminated Logic(HSUL_12) I/O
Interface
Clock Frequency Range : 10MHz to 400MHz
(data rate range : 20Mbps to 800 Mbps per I/O)
Four-bit Pre-fetch DDR Architecture
Multiplexed, double data rate, command/ad-
dress inputs
Eight internal banks for concurrent operation
Bidirectional/differential data strobe per byte of
data (DQS/DQS#)
Programmable Read/Write latencies(RL/WL)
and burst lengths(4,8 or 16)
Per-bank refresh for concurrent operation
ZQ Calibration
On-chip temperature sensor to control self re-
fresh rate
Partial –array self refresh(PASR) – Bank & Seg-
ment masking
Deep power-down mode(DPD)
Operation Temperature
Commercial (T
C
= 0°C to 85°C)
Industrial (T
C
= -40°C to 85°C)
Automotive, A1 (T
C
= -40°C to 85°C)
Automotive, A2 (T
C
= -40°C to 105°C)
AUGUst 2014
descRiption
The IS43/46LD16640A/32320A is 1,073,741,824 bits
CMOS Mobile Double Data Rate Synchronous DRAMs
organized as 8 banks (S4). The deviceis organized as 8
banks of 8Meg words of 16bits or 4Meg words of 32bits.
This product uses a double-data-rate architecture to
achieve high-speed operation. The double data rate
architecture is essentially a 4N prefetch architecture
with an interface designed to transfer two data words
per clock cycle at the I/O pins. This product offers fully
synchronous operations referenced to both rising and
falling edges of the clock. The data paths are internally
pipelined and 4n bits prefetched to achieve very high
bandwidth.
AddRess tABLe
Parameter
Row Addresses
Column Addresses
Bank Addresses
Refresh Count
32Mx32
R0-R12
C0-C8
BA0-BA2
4K
64Mx16
R0-R12
C0-C9
BA0-BA2
4K
keY tiMinG pARAMeteRs
Speed
Grade
-25
-3
Data
Rate
(Mb/s)
800
667
Write
Read tRCD/
Latency Latency tRP
3
2
6
5
Typical
Typical
options
Configuration:
− 64Mx16 (8M x 16 x 8 banks)
− 32Mx32 (4M x 32 x 8 banks)
Package:
− 134-ball BGA for x16 / x32
− 168-ball PoP BGA for x32
Note:
Other clock frequencies/data rates supported; please
refer to AC timing tables.
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be ex-
pected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon
Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
8/6/2014
1
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