RSS090N03
Transistors
Switching (30V, 9A)
RSS090N03
Features
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small and Surface Mount Package (SOP8).
External dimensions
(Unit : mm)
SOP8
(8)
5.0±0.2
(5)
6.0±0.3
3.9±0.15
Max.1.75
1.5±0.1
0.15
Application
Power switching, DC/DC converter.
1.27
0.4±0.1
0.1
Each lead has same dimensions
Structure
Silicon N-channel
MOS FET
Absolute maximum ratings
(Ta = 25°C)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous
Drain Current
Source Current
(Body Diode)
Pulsed
Continuous
Pulsed
Symbol
V
DSS
V
GSS
I
D
I
DP
I
s
I
sp
P
D
Tch
Tstg
Limits
30
20
±9.0
±36
1.6
6.4
2
150
−55
to
+150
Unit
V
V
A
A
A
A
W
∗
1
∗
2
∗
1
Equivalent circuit
(8) (7) (6) (5)
(8)
(7)
(6)
(5)
∗
2
0.5±0.1
(1)
(4)
0.2±0.1
∗
1
(2)
(3)
(4)
(1) (2) (3) (4)
(1)
Total Power Dissipation
Channel Temperature
Storage Temperature
∗1
Pw≤10µs, Duty cycle≤1%
∗
2 Mounted on a ceramic board.
°C
°C
∗1
ESD Protection Diode.
∗2
Body
Diode.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Source
Source
Source
Gate
Drain
Drain
Drain
Drain
∗
A protection diode is included between the gate
and the source terminals to protect the diode
against static electricity when the product is in
use.Use a protection circuit when the fixed
voltage are exceeded.
Thermal resistance
(Ta = 25°C)
Parameter
Channel to Ambient
∗
Mounted on a ceramic board.
Symbol
Rth (ch-a)
Limits
62.5
Unit
°C
/ W
∗
1/3
RSS090N03
Transistors
Electrical characteristic curves
10000
GATE-SOURCE VOLTAGE: V
GS
(V)
Ta=25°C
f=1MHz
V
GS
=0V
C
iss
10000
Ta=25°C
V
DD
=15V
V
GS
=10V
R
G
=10Ω
Pulsed
8
Ta=25
C
7
V
DD
=15V
I
D
=
9A
6
R
G
=10Ω
Pulsed
5
4
3
2
1
0
0
2
4
6
8
10
12
CAPACITANCE : C
(pF)
SWITCHING TIME : t
(ns)
1000
tf
td(off)
1000
C
oss
100
C
rss
100
td(on)
10
tr
10
0.01
0.1
1
10
100
1
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : V
DS
(V)
DRAIN CURRENT : I
D
(A)
TOTAL GATE CHANGE: Qg (nC)
Fig.1 Typical Capacitance
vs. Drain-Source Voltage
Fig.2 Switching Characteristics
Fig.3 Dynamic Input Characteristics
10
100
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS(on)
(mΩ)
Ta=25 C
pulsed
SOURCE CURRENT : Is
(A)
100
V
GS
=
0V
Pulsed
Ta=−25°C
25°C
75°C
125°C
DREIN CURRENT : I
D
(A)
1
I
D
=9A
10
0.1
Ta=125°C
75°C
25°C
−25°C
50
1
0.01
I
D
=4.5A
0.1
V
DS
=
10V
0.001 Pulsed
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
0
0.01
2
4
6
8
10
12
14
16
0
0.5
1.0
1.5
GATE - SOURCE VOLTAGE : V
GS
(V)
GATE-SOURCE VOLTAGE : V
GS
(V)
SOURCE-DRAIN VOLTAGE : V
SD
(A)
Fig.4 Typical Transfer Characteristics
Fig.5 Static Drain-Source
On-State Resistance vs.
Gate-Source Voltage
Fig.6 Source-Current vs.
Source-Drain Voltage
10000
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS(on)
(mΩ)
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS(on)
(mΩ)
1000
Ta=125°C
75°C
25°C
−25°C
1000
Ta=125°C
75°C
25°C
−25°C
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS(on)
(mΩ)
V
GS
=
10V
Pulsed
10000
V
GS
=
4.5V
Pulsed
10000
V
GS
=
4V
Pulsed
1000
Ta=125°C
75°C
25°C
−25°C
100
100
100
10
10
10
1
0.1
1
DRAIN CURRENT : I
D
(A)
10
1
0.1
1
DRAIN CURRENT : I
D
(A)
10
1
0.1
1
DRAIN CURRENT : I
D
(A)
10
Fig.7 Static Drain-Source
On-State Resistance
vs. Drain Current (1)
Fig.8 Static Drain-Source On-State
Resistance vs. Drain Current (2)
Fig.9 Static Drain-Source
On-State Resistance
vs. Drain Current (3)
3/3
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document use silicon as a basic material.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.0
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