RF System on a Chip - SoC CC2510 32kB Chipset Tape and Reel
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC36,.25SQ,20 |
| 针数 | 36 |
| Reach Compliance Code | compli |
| Factory Lead Time | 1 week |
| Samacsys Descripti | RF Transceiver, and USB Controlle |
| JESD-30 代码 | S-XQCC-N36 |
| JESD-609代码 | e4 |
| 长度 | 6 mm |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 36 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC36,.25SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.9 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6 mm |
| CC2510F32RSPR | CC2510F32RSP | CC2510F8RSP | CC2511EMK | CC2510F16RSP | CC2510EMK | |
|---|---|---|---|---|---|---|
| 描述 | RF System on a Chip - SoC CC2510 32kB Chipset Tape and Reel | RF System on a Chip - SoC CC2510 32kB Chipset | RF System on a Chip - SoC CC2510 8kB Chipset | Development Boards & Kits - Wireless CC2511EMK Eval Mod | RF System on a Chip - SoC CC2510 16kB Chipset | Development Boards & Kits - Wireless CC2510EMK Eval Mod |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - |
| 零件包装代码 | QFN | QFN | QFN | - | QFN | - |
| 包装说明 | HVQCCN, LCC36,.25SQ,20 | HVQCCN, LCC36,.25SQ,20 | HVQCCN, LCC36,.25SQ,20 | - | HVQCCN, LCC36,.25SQ,20 | - |
| 针数 | 36 | 36 | 36 | - | 36 | - |
| Reach Compliance Code | compli | compli | compli | - | compli | - |
| Factory Lead Time | 1 week | 1 week | 1 week | - | 1 week | - |
| JESD-30 代码 | S-XQCC-N36 | S-XQCC-N36 | S-XQCC-N36 | - | S-XQCC-N36 | - |
| JESD-609代码 | e4 | e4 | e4 | - | e4 | - |
| 长度 | 6 mm | 6 mm | 6 mm | - | 6 mm | - |
| 湿度敏感等级 | 3 | 3 | 3 | - | 3 | - |
| 功能数量 | 1 | 1 | 1 | - | 1 | - |
| 端子数量 | 36 | 36 | 36 | - | 36 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | - |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | - | HVQCCN | - |
| 封装等效代码 | LCC36,.25SQ,20 | LCC36,.25SQ,20 | LCC36,.25SQ,20 | - | LCC36,.25SQ,20 | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | - | SQUARE | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | - | 260 | - |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - | 2.5/3.3 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 0.9 mm | 0.9 mm | 0.9 mm | - | 0.9 mm | - |
| 标称供电电压 | 3 V | 3 V | 3 V | - | 3 V | - |
| 表面贴装 | YES | YES | YES | - | YES | - |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | - |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | - | RF AND BASEBAND CIRCUIT | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | - | QUAD | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 宽度 | 6 mm | 6 mm | 6 mm | - | 6 mm | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
