Development Boards & Kits - Wireless CC2511EMK Eval Mod
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | Texas Instruments(德州仪器) |
| 产品种类 Product Category | Development Boards & Kits - Wireless |
| RoHS | Details |
| 产品 Product | Evaluation Kits |
| Core | 8051 |
| RF Frequency | 2.4 GHz |
| 工具用于评估 Tool Is For Evaluation Of | CC2511 |
| 接口类型 Interface Type | USB |
| 工厂包装数量 Factory Pack Quantity | 1 |
| CC2511EMK | CC2510F32RSP | CC2510F8RSP | CC2510F32RSPR | CC2510F16RSP | CC2510EMK | |
|---|---|---|---|---|---|---|
| 描述 | Development Boards & Kits - Wireless CC2511EMK Eval Mod | RF System on a Chip - SoC CC2510 32kB Chipset | RF System on a Chip - SoC CC2510 8kB Chipset | RF System on a Chip - SoC CC2510 32kB Chipset Tape and Reel | RF System on a Chip - SoC CC2510 16kB Chipset | Development Boards & Kits - Wireless CC2510EMK Eval Mod |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | - | QFN | QFN | QFN | QFN | - |
| 包装说明 | - | HVQCCN, LCC36,.25SQ,20 | HVQCCN, LCC36,.25SQ,20 | HVQCCN, LCC36,.25SQ,20 | HVQCCN, LCC36,.25SQ,20 | - |
| 针数 | - | 36 | 36 | 36 | 36 | - |
| Reach Compliance Code | - | compli | compli | compli | compli | - |
| Factory Lead Time | - | 1 week | 1 week | 1 week | 1 week | - |
| JESD-30 代码 | - | S-XQCC-N36 | S-XQCC-N36 | S-XQCC-N36 | S-XQCC-N36 | - |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | - |
| 长度 | - | 6 mm | 6 mm | 6 mm | 6 mm | - |
| 湿度敏感等级 | - | 3 | 3 | 3 | 3 | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | - |
| 端子数量 | - | 36 | 36 | 36 | 36 | - |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN | - |
| 封装等效代码 | - | LCC36,.25SQ,20 | LCC36,.25SQ,20 | LCC36,.25SQ,20 | LCC36,.25SQ,20 | - |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | - |
| 电源 | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm | - |
| 标称供电电压 | - | 3 V | 3 V | 3 V | 3 V | - |
| 表面贴装 | - | YES | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | - |
| 电信集成电路类型 | - | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | - | QUAD | QUAD | QUAD | QUAD | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 6 mm | 6 mm | 6 mm | 6 mm | - |
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