Detail contact area
8,03
4,34
21,65
1,78
14,75
11,66
Mittellinie Leiterplatte
15,24
Centerline of daughter card
PIN 1
A
C
20
Offset von Führungssteg zu Referenzzapfen
0,15
10
Offset from guiding bar to reference peg
Datum
NOTES:
Material: LCP GF 30 schwarz
Date code (see notes)
Material: LCP GF 30 black
Galvanik: min. 1,27 µm Unternickelung
über gesamten PIN - Bereich
min. 0,8 µm Au (30 µinch) im Steckbereich
Gold - Flash im Lötbereich
XXXX_XX ERNI RC X
Plating: min. 1,27 µm Ni entire contact
min. 0,8 µm Au (30 µinch) in contact area
Gold - Flash plating on contact tails
1.) Fertiglochdurchmesser
finished viadiameter (PTH)
Package: Tray ( 20 pcs.)
39,5
M 1:1
Lochbild für Leiterplatte (Bestückungsseite)
Board hole pattern (component mounting side)
20
B32
B12
3
10
1
B2
B1
daughter card layout
22,15
12,14
10
0,71
1,4
1.)
0,7
±0,08
1,57 across pads
20,3
16,69
Maß "B"
2,54
Maß "C"
5,59
2
4
B
2,5
8,41
Maß "A"
15,24
2
A32
A12
2,35 (2x)
A1
Dim "A"
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
Dim "B"
Dim "C"
4,48
Information:
Tolerances
All Dimensions
in mm
Scale
5:1
3,12
A2
1,35
23,15
39,5
14,9
20 x 1 = 20
1,49
1,91
±0,05
Layout proposal is in accordance with the PCI Express spezification
2 0°
All rights reserved.
Only for Information.
To ensure that this is the latest
version of this drawing, please
contact one of the ERNI companies
before using.
c
Index
04.11.2011
Date
Designation
Subject to modification without
prior notice.
Drawing will not be updated.
Abgew. PCI Express STV 64pol.
RT. Angle PCI Express 64 pins
www.ERNI.com
Class
100101350001
PCIEXP
K
A2
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