Digital Video Encoder ECO-DENC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | QFP, QFP64,.47SQ,20 |
| Reach Compliance Code | unknow |
| 商用集成电路类型 | COLOR SIGNAL ENCODER |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e0 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP64,.47SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| SAA7125HZ | SAA7125WP | SAA7125H | SAA7125 | SAA7124WP | SAA7124HZ | SAA7124H | SAA7124 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Video Encoder ECO-DENC | Digital Video Encoder ECO-DENC | Digital Video Encoder ECO-DENC | Digital Video Encoder ECO-DENC | Digital Video Encoder ECO-DENC | Digital Video Encoder ECO-DENC | Digital Video Encoder ECO-DENC | Digital Video Encoder ECO-DENC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
| 包装说明 | QFP, QFP64,.47SQ,20 | QCCJ, LDCC84,1.2SQ | QFP, QFP80,.75X1,32 | - | QCCJ, LDCC84,1.2SQ | QFP, QFP64,.47SQ,20 | QFP, QFP80,.75X1,32 | - |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow | unknow | unknow | - |
| 商用集成电路类型 | COLOR SIGNAL ENCODER | COLOR SIGNAL ENCODER | COLOR SIGNAL ENCODER | - | COLOR SIGNAL ENCODER | COLOR SIGNAL ENCODER | COLOR SIGNAL ENCODER | - |
| JESD-30 代码 | S-PQFP-G64 | S-PQCC-J84 | R-PQFP-G80 | - | S-PQCC-J84 | S-PQFP-G64 | R-PQFP-G80 | - |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | - |
| 端子数量 | 64 | 84 | 80 | - | 84 | 64 | 80 | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | QFP | QCCJ | QFP | - | QCCJ | QFP | QFP | - |
| 封装等效代码 | QFP64,.47SQ,20 | LDCC84,1.2SQ | QFP80,.75X1,32 | - | LDCC84,1.2SQ | QFP64,.47SQ,20 | QFP80,.75X1,32 | - |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | - | SQUARE | SQUARE | RECTANGULAR | - |
| 封装形式 | FLATPACK | CHIP CARRIER | FLATPACK | - | CHIP CARRIER | FLATPACK | FLATPACK | - |
| 电源 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 表面贴装 | YES | YES | YES | - | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | GULL WING | J BEND | GULL WING | - | J BEND | GULL WING | GULL WING | - |
| 端子节距 | 0.5 mm | 1.27 mm | 0.8 mm | - | 1.27 mm | 0.5 mm | 0.8 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | - | QUAD | QUAD | QUAD | - |
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