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MA4SPS552

SURMOUNT

TM

PIN Diode

Rev. V3

Features



Surface Mount Device

No Wirebonds Required

Rugged Silicon-Glass Construction

Silicon Nitride Passivation

Polymer Scratch Protection

Ultra-Low Parasitic Capacitance and Inductance

Higher Power Handling (Efficient Heat sinking)

RoHS* Compliant

Package Dimensions

2

A

B

Description

The MA4SPS552 is a silicon-glass PIN diode chip

fabricated with MACOM’s patented HMIC process.

This device features two silicon pedestals

embedded in a low loss glass. The diode is formed

on the top of one pedestal and connections to the

backside of the device are facilitated by making the

pedestal sidewalls conductive. Selective backside

metallization is applied producing a surface mount

device. The topside is fully encapsulated with

silicon nitride and has an additional polymer layer

for scratch protection. These protective coatings

prevent damage to the junction and the anode

air-bridge during handling and assembly.

These packageless devices are suitable for usage

in moderate incident power (5 W CW) or higher

incident peak power (200 W, 1 µs, 0.001 Duty)

series, shunt, or series-shunt switches. Small

parasitic inductance, 0.7 nH, and excellent RC

constant (0.20 ps) make the devices ideal for TR

switch and accessory switch circuits, where higher

P1db and IP3 values are required.

These diodes can also be used in π, T, Tapered

Resistance, and Switched-Pad Attenuator Control

Circuits for 50 Ω or 75 Ω systems.

C

D

E

F

G

DIM

A

B

C

D

INCHES

MIN

0.0207

0.0108

0.0040

0.0075

0.0032

0.0061

0.0069

MAX

0.0226

0.0128

0.0080

0.0095

0.004

0.0081

0.0089

MIN

0.525

0.275

0.102

0.190

0.081

0.155

0.175

MM

MAX

0.575

0.325

0.203

0.241

0.101

0.205

0.225

Ordering Information

Part Number

MA4SPS552

MADP-000552-12810T

1

Package

100 pc. die in carrier

3000 pc. pocket tape on reel

E

F

G

1. Reference Application Note M513 for reel size information.

2. Backside metal: 0.1 μm thick.

* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.

1

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit

www.macom.com

for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MA4SPS552

SURMOUNT

TM

PIN Diode

Rev. V3

Electrical Specifications @ +25°C

Symbol

C

T

Parameter

Capacitance

Conditions

-40 V, 1 MHz

-40 V, 1 GHz

100 mA, 100 MHz

20 mA, 100 MHz

100 mA

10 mA

-10 µA

-40 V

Steady State

+10 mA / -6 mA

( 50% - 90% V )

Units

pF

Min.

—

Typ.

0.08

0.06

1.7

2.4

1.00

0.88

| - 275 |

| - 10 |

30

2.5

Max.

0.14

—

1.25

1.00

—

R

S

V

F

V

R

I

R

RӨ

JC

T

L

Resistance

Forward Voltage

Reverse Voltage

Reverse Leakage Current

Thermal Resistance

Lifetime

Ω

V

nA

°C/W

µs

—

| - 200 |

—

Absolute Maximum Ratings

3,4

Parameter

Dissipated RF & DC Power

Forward Current

Reverse Voltage

Operating Temperature

Storage Temperature

Junction Temperature

Mounting Temperature

Absolute Maximum

1W

100 mA

-200 V

-65°C to +150°C

+175°C

+260°C

Handling Procedures

Please observe the following precautions to avoid

damage:

Static Sensitivity

These electronic devices are sensitive to

electrostatic discharge (ESD) and can be damaged

by static electricity. Proper ESD control techniques

should be used when handling these devices.

3. Exceeding any one or combination of these limits may cause

permanent damage to this device.

4. MACOM does not recommend sustained operation near these

survivability limits.

2

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit

www.macom.com

for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MA4SPS552

SURMOUNT

TM

PIN Diode

Rev. V3

Typical Performance Curves

Capacitance vs. Frequency

0.20

0.18

0.16

0V

-5 V

-40 V

Capacitance vs. Voltage

0.20

0.18

0.16

CT (pF)

0.12

0.10

0.08

0.06

0.04

0.0

0.2

0.4

0.6

0.8

1.0

CT (pF)

0.14

0.12

0.10

0.08

0.06

0.04

0

10

20

30

100 MHz

1 GHz

40

Frequency (GHz)

Voltage (V)

Series Resistance vs. Frequency

4.0

Series Resistance vs. Current

100.0

3.0

100 MHz

1 GHz

R

S

(ohm)

2.0

R

S

(ohm)

10 mA

20 mA

50 mA

100 mA

10.0

1.0

0.0

0.1

0.2

0.3

0.4

0.6

0.7

0.8

0.9

1.0

0.01

0.1

1

10

100

Frequency (GHz)

Current (mA)

Series Resistance vs. Reverse Bias

1,000,000

100,000

100 MHz

1 GHz

R

P

(ohm)

10,000

1,000

0

-10

-20

-30

-40

3

Reverse Bias (-V)

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit

www.macom.com

for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MA4SPS552

SURMOUNT

TM

PIN Diode

Rev. V3

Typical Performance Curves

Insertion Loss vs. Frequency

0.0

Isolation vs. Frequency

0

-0.2

-10

S21 (dB)

-0.4

S21 (dB)

0

1

2

3

4

5

6

-20

-0.6

-30

-0.8

-40

0

1

2

3

4

5

6

Frequency (GHz)

Input Return Loss vs. Frequency

-10

Output Return Loss vs. Frequency

-10

-20

S11 (dB)

-30

S22 (dB)

-30

-40

0

1

2

3

4

5

6

-40

0

1

2

3

4

5

6

Frequency (GHz)

4

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit

www.macom.com

for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MA4SPS552

SURMOUNT

TM

PIN Diode

Rev. V3

Handling

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin

oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.

Bulk handling should insure that abrasion and mechanical shock are minimized.

Die Attach

Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are

conveniently located on the bottom surface of these devices and are removed from the active junction locations.

These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn and

60Sn/40Pb solder is recommended. Conductive epoxy for attachment may also be used.

When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a

vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device.

When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting

pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the

solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to

the top surface of the die. Equal Heat must be applied to both ohmic contacts. Since the HMIC glass is transpar-

ent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is

completed.

Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in

Application Note M538

, “Surface Mounting Instructions“.

5

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit

www.macom.com

for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

MADP-000552-12810T

MADP-000552-12810T概述

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