Data Communications ICs
| SAB82525 | SAF82526N | SAF82525N | SAF82525 | SAB82526N | SAB82526 | SAB82525N | SAB82525H | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | - | Infineon(英飞凌) | Infineon(英飞凌) | - | Infineon(英飞凌) | - | Infineon(英飞凌) | Infineon(英飞凌) |
| 零件包装代码 | - | LCC | LCC | - | LCC | - | LCC | QFP |
| 包装说明 | - | PLASTIC, LCC-44 | PLASTIC, LCC-44 | - | PLASTIC, LCC-44 | - | PLASTIC, LCC-44 | PLASTIC, MQFP-44 |
| 针数 | - | 44 | 44 | - | 44 | - | 44 | 44 |
| Reach Compliance Code | - | compliant | unknow | - | unknown | - | unknow | _compli |
| 地址总线宽度 | - | 7 | 7 | - | 7 | - | 7 | 7 |
| 边界扫描 | - | NO | NO | - | NO | - | NO | NO |
| 总线兼容性 | - | 8051; 80188; 80186 | 8051; 80188; 80186 | - | 8051; 80188; 80186 | - | 8051; 80188; 80186 | 8051; 80188; 80186 |
| 最大时钟频率 | - | 19.3 MHz | 19.3 MHz | - | 19.3 MHz | - | 19.3 MHz | 19.3 MHz |
| 通信协议 | - | SYNC, HDLC; SYNC, SDLC; X.25 | SYNC, HDLC; SYNC, SDLC; X.25 | - | SYNC, HDLC; SYNC, SDLC; X.25 | - | SYNC, HDLC; SYNC, SDLC; X.25 | SYNC, HDLC; SYNC, SDLC; X.25 |
| 数据编码/解码方法 | - | NRZ; NRZI | NRZ; NRZI | - | NRZ; NRZI | - | NRZ; NRZI | NRZ; NRZI |
| 最大数据传输速率 | - | 0.5 MBps | 0.5 MBps | - | 0.5 MBps | - | 0.5 MBps | 0.5 MBps |
| 外部数据总线宽度 | - | 8 | 8 | - | 8 | - | 8 | 8 |
| JESD-30 代码 | - | S-PQCC-J44 | S-PQCC-J44 | - | S-PQCC-J44 | - | S-PQCC-J44 | S-PQFP-G44 |
| JESD-609代码 | - | e0 | e0 | - | e0 | - | e0 | e0 |
| 长度 | - | 16.6 mm | 16.6 mm | - | 16.6 mm | - | 16.6 mm | 10 mm |
| 低功率模式 | - | YES | YES | - | YES | - | YES | YES |
| 串行 I/O 数 | - | 2 | 2 | - | 2 | - | 2 | 2 |
| 端子数量 | - | 44 | 44 | - | 44 | - | 44 | 44 |
| 最高工作温度 | - | 85 °C | 85 °C | - | 70 °C | - | 70 °C | 70 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | QCCJ | QCCJ | - | QCCJ | - | QCCJ | QFP |
| 封装等效代码 | - | LDCC44,.7SQ | LDCC44,.7SQ | - | LDCC44,.7SQ | - | LDCC44,.7SQ | QFP44,.5SQ,32 |
| 封装形状 | - | SQUARE | SQUARE | - | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER | CHIP CARRIER | - | CHIP CARRIER | - | CHIP CARRIER | FLATPACK |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 5 V | 5 V | - | 5 V | - | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 4.57 mm | 4.57 mm | - | 4.57 mm | - | 4.57 mm | 2.45 mm |
| 最大压摆率 | - | 8.2 mA | 8.2 mA | - | 8.2 mA | - | 8.2 mA | 8 mA |
| 最大供电电压 | - | 5.25 V | 5.25 V | - | 5.25 V | - | 5.25 V | 5.25 V |
| 最小供电电压 | - | 4.75 V | 4.75 V | - | 4.75 V | - | 4.75 V | 4.75 V |
| 标称供电电压 | - | 5 V | 5 V | - | 5 V | - | 5 V | 5 V |
| 表面贴装 | - | YES | YES | - | YES | - | YES | YES |
| 技术 | - | CMOS | CMOS | - | CMOS | - | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | J BEND | J BEND | - | J BEND | - | J BEND | GULL WING |
| 端子节距 | - | 1.27 mm | 1.27 mm | - | 1.27 mm | - | 1.27 mm | 0.8 mm |
| 端子位置 | - | QUAD | QUAD | - | QUAD | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 16.6 mm | 16.6 mm | - | 16.6 mm | - | 16.6 mm | 10 mm |
| uPs/uCs/外围集成电路类型 | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
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