Data Communications ICs
SAB82526 | SAF82526N | SAF82525N | SAF82525 | SAB82526N | SAB82525N | SAB82525H | SAB82525 | |
---|---|---|---|---|---|---|---|---|
描述 | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs | Data Communications ICs |
是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
厂商名称 | - | Infineon(英飞凌) | Infineon(英飞凌) | - | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | - |
零件包装代码 | - | LCC | LCC | - | LCC | LCC | QFP | - |
包装说明 | - | PLASTIC, LCC-44 | PLASTIC, LCC-44 | - | PLASTIC, LCC-44 | PLASTIC, LCC-44 | PLASTIC, MQFP-44 | - |
针数 | - | 44 | 44 | - | 44 | 44 | 44 | - |
Reach Compliance Code | - | compliant | unknow | - | unknown | unknow | _compli | - |
地址总线宽度 | - | 7 | 7 | - | 7 | 7 | 7 | - |
边界扫描 | - | NO | NO | - | NO | NO | NO | - |
总线兼容性 | - | 8051; 80188; 80186 | 8051; 80188; 80186 | - | 8051; 80188; 80186 | 8051; 80188; 80186 | 8051; 80188; 80186 | - |
最大时钟频率 | - | 19.3 MHz | 19.3 MHz | - | 19.3 MHz | 19.3 MHz | 19.3 MHz | - |
通信协议 | - | SYNC, HDLC; SYNC, SDLC; X.25 | SYNC, HDLC; SYNC, SDLC; X.25 | - | SYNC, HDLC; SYNC, SDLC; X.25 | SYNC, HDLC; SYNC, SDLC; X.25 | SYNC, HDLC; SYNC, SDLC; X.25 | - |
数据编码/解码方法 | - | NRZ; NRZI | NRZ; NRZI | - | NRZ; NRZI | NRZ; NRZI | NRZ; NRZI | - |
最大数据传输速率 | - | 0.5 MBps | 0.5 MBps | - | 0.5 MBps | 0.5 MBps | 0.5 MBps | - |
外部数据总线宽度 | - | 8 | 8 | - | 8 | 8 | 8 | - |
JESD-30 代码 | - | S-PQCC-J44 | S-PQCC-J44 | - | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 | - |
JESD-609代码 | - | e0 | e0 | - | e0 | e0 | e0 | - |
长度 | - | 16.6 mm | 16.6 mm | - | 16.6 mm | 16.6 mm | 10 mm | - |
低功率模式 | - | YES | YES | - | YES | YES | YES | - |
串行 I/O 数 | - | 2 | 2 | - | 2 | 2 | 2 | - |
端子数量 | - | 44 | 44 | - | 44 | 44 | 44 | - |
最高工作温度 | - | 85 °C | 85 °C | - | 70 °C | 70 °C | 70 °C | - |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | - | QCCJ | QCCJ | - | QCCJ | QCCJ | QFP | - |
封装等效代码 | - | LDCC44,.7SQ | LDCC44,.7SQ | - | LDCC44,.7SQ | LDCC44,.7SQ | QFP44,.5SQ,32 | - |
封装形状 | - | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | - |
封装形式 | - | CHIP CARRIER | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER | FLATPACK | - |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
电源 | - | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | - | 4.57 mm | 4.57 mm | - | 4.57 mm | 4.57 mm | 2.45 mm | - |
最大压摆率 | - | 8.2 mA | 8.2 mA | - | 8.2 mA | 8.2 mA | 8 mA | - |
最大供电电压 | - | 5.25 V | 5.25 V | - | 5.25 V | 5.25 V | 5.25 V | - |
最小供电电压 | - | 4.75 V | 4.75 V | - | 4.75 V | 4.75 V | 4.75 V | - |
标称供电电压 | - | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
表面贴装 | - | YES | YES | - | YES | YES | YES | - |
技术 | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | - |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | - | J BEND | J BEND | - | J BEND | J BEND | GULL WING | - |
端子节距 | - | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 0.8 mm | - |
端子位置 | - | QUAD | QUAD | - | QUAD | QUAD | QUAD | - |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | - | 16.6 mm | 16.6 mm | - | 16.6 mm | 16.6 mm | 10 mm | - |
uPs/uCs/外围集成电路类型 | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | - |
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