Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPA06N60C3
MA001044372
PG-TO220-3-121
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
4.096
0.687
0.206
686.221
0.708
2.210
207.774
895.195
7.942
0.305
0.001
0.245
0.612
1.591
0.130
0.433
432.110
Average
Mass
[%]
0.18
0.03
0.01
30.63
0.03
0.10
9.27
39.96
0.35
0.01
0.00
0.01
0.03
0.07
0.01
0.02
19.29
28. August 2013
2240.47 mg
Sum
[%]
0.18
Average
Mass
[ppm]
1828
307
92
30.67
0.03
306285
316
987
92737
49.33
0.35
399557
3545
136
0.01
1
109
273
0.11
710
58
193
19.32
192866
193117
1000000
1092
136
493282
3545
306684
316
Sum
[ppm]
1828
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com