Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSP76 E6433
MA001121454
PG-SOT223-4-21
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.115
0.010
0.051
0.152
50.489
0.377
0.461
0.576
1.153
10.491
44.963
1.464
0.513
0.086
0.405
Average
Mass
[%]
0.99
0.01
0.05
0.14
44.94
0.34
0.41
0.51
1.03
9.34
40.04
1.30
0.46
0.08
0.36
29. August 2013
112.31 mg
Sum
[%]
0.99
Average
Mass
[ppm]
9932
90
451
1354
45.14
0.34
449565
3359
4106
5133
10266
93416
51.33
1.30
0.46
400355
13036
4568
765
0.44
3604
4369
1000000
513276
13036
4568
451460
3359
Sum
[ppm]
9932
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
