Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPD04N50C3
MA001145696
PG-TO252-3-313
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
3.265
0.147
0.044
147.096
0.527
1.405
24.581
114.475
3.740
0.003
1.421
0.074
0.059
2.820
0.019
0.006
19.177
Average
Mass
[%]
1.02
0.05
0.01
46.14
0.17
0.44
7.71
35.90
1.17
0.00
0.45
0.02
0.02
0.88
0.01
0.00
6.01
29. August 2013
318.86 mg
Sum
[%]
1.02
Average
Mass
[ppm]
10240
462
139
46.20
0.17
461320
1654
4405
77089
44.05
1.17
359015
11729
11
0.45
4455
231
185
0.92
8843
60
18
6.02
60144
60222
1000000
9259
4466
440509
11729
461921
1654
Sum
[ppm]
10240
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com