General Purpose Axial Lead Glass Packaged Schottky Diodes
Features
Low Reverse Leakage Current
Low Forward Voltage Drop
Pico second Switching Speed
Offered in Tape and Reel Packaging
RoHS* Compliant
Rev. V2
Glass Package Style
Description and Applications
These silicon diodes are packaged in a hermetic
axial lead glass package. Various uses include de-
tecting, mixing and switching at low power levels.
They are suitable for commercial switching along
with control functions in narrow band receivers.
These diodes can also be used in the UHF and VHF
frequency bands for pulse shaping, sampling and as
fast logic gates.
Schottky Chip
Glass Cylinder
Tin Plated Dumet Leads
Ordering Information
Part Number
1N5711
MADS-005711– 0054MT
1N5712
MADS-005712- 0054MT
Package
ESD Bag
1000 piece reel
ESD Bag
1000 piece reel
ODS-54
Electrical Specifications
1
: T
A
= +25°C
Parameters and Test Conditions
Forward Voltage @ 1 mA
Forward Voltage @ 15 mA
Forward Voltage @ 35 mA
Voltage Breakdown @ 10 µA
Leakage Current @ 50 V
Leakage Current @ 15 V
Total Capacitance @ 0 V at 1 MHz
2
Symbol
Vf
Vf
Vf
Vb
Ir
Ir
Ct
Units
V
V
V
V
nA
nA
pF
1N5711
MADS-005711-0054MT
Min.
Max.
—
—
—
70
—
—
—
.410
1
—
—
200
—
2.0
1N5712
MADS-005712-0054MT
Min.
Max.
—
—
—
20
—
—
—
.550
—
1
—
—
150
1.2
1. Effective minority carrier lifetime (Tl) is 100 pS maximum measured with the Krakauer method at 5 mA.
1
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1N5711, 1N5712,
MADS-005711, MADS-005712
General Purpose Axial Lead Glass Packaged Schottky Diodes
Absolute Maximum Ratings
2,3
Parameter
Reverse Voltage
Power Dissipation
Soldering Temperature
Operating Temperature
Storage Temperature
Absolute Maximum
See voltage ratings
250 mW
Derate linearly to 0 @ 135°C
+230°C for 5 seconds
1 mm from glass
-65°C to +150°C
-65°C to +200°C
Rev. V2
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these HBM Class 0
devices.
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
3. MACOM does not recommend sustained operation near
these survivability limits.
Package Outline Dimensions
A
B
C
Assembly Recommendations
Leads on axial leaded devices must be formed
while being held firm. Bending the leads too
close to the body of the part may cause internal
damage to the device. Bends <0.060” from body
are not recommended. Appropriate fixturing
should be used.
Devices may be soldered using standard 60/40,
Sn/Pb or RoHS compliant solders. Axial leads
are tin plated, 50 μM, thick to ensure an
optimum connection.
D
(2 plcs)
Dimension
A
B
C
D (min.)
Mils
155 ± 10
71 ± 3
15 ± 1
1000
mm
3.94 ± 0.25
1.8 ± 0.08
0.38 ± 0.03
25.4
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1N5711, 1N5712,
MADS-005711, MADS-005712
General Purpose Axial Lead Glass Packaged Schottky Diodes
Rev. V2
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
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WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
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3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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