Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-C505CA-2RM CA
MA001064148
PG-MQFP-44-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
11.934
0.199
0.860
3.971
127.353
2.301
1.040
44.007
301.465
5.710
3.751
0.648
2.590
Average
Mass
[%]
2.36
0.04
0.17
0.79
25.18
0.45
0.21
8.70
59.59
1.13
0.74
0.13
0.51
29. August 2013
505.83 mg
Sum
[%]
2.36
Average
Mass
[ppm]
23594
393
1701
7851
26.18
0.45
251771
4548
2055
87000
68.50
1.13
0.74
595983
11289
7415
1280
0.64
5120
6400
1000000
685038
11289
7415
261716
4548
Sum
[ppm]
23594
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com