Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IHW20N120R3
MA001094548
PG-TO247-3-44
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
4.575
0.530
0.159
529.068
4.496
20.020
380.385
1601.622
31.874
29.065
0.272
0.681
1.771
3.442
1.033
3438.006
Average
Mass
[%]
0.08
0.01
0.00
8.75
0.07
0.33
6.29
26.49
0.53
0.48
0.00
0.01
0.03
0.06
0.02
56.85
29. August 2013
6047.00 mg
Sum
[%]
0.08
Average
Mass
[ppm]
757
88
26
8.76
0.07
87493
744
3311
62905
33.11
0.53
0.48
264862
5271
4806
45
113
0.04
293
569
171
56.93
568546
569286
1000000
451
331078
5271
4806
87607
744
Sum
[ppm]
757
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com