Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
PMA7107
MA000793218
PG-TSSOP-38-4
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
gold
silver
palladium
nickel
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
7440-05-3
7440-02-0
-
7440-22-4
Issued
Weight*
Weight
[mg]
4.898
0.075
0.326
1.504
48.239
0.640
0.181
7.648
52.395
0.009
0.005
0.005
0.160
0.325
1.301
Average
Mass
[%]
4.16
0.06
0.28
1.28
40.98
0.54
0.15
6.50
44.51
0.01
0.00
0.00
0.14
0.28
1.11
29. August 2013
117.71 mg
Sum
[%]
4.16
Average
Mass
[ppm]
41614
639
2769
12780
42.60
0.54
409807
5437
1535
64976
51.16
445110
74
40
46
0.15
1357
2763
1.39
11053
13816
1000000
1517
511621
425995
5437
Sum
[ppm]
41614
wire
encapsulation
noble metal
organic material
plastics
inorganic material
noble metal
noble metal
noble metal
non noble metal
plastics
noble metal
< 10%
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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