Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BC 857BW H6327
MA000845522
PG-SOT323-3-1
Material Group
non noble metal
noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
arsenic
gold
silicon
silicon
titanium
chromium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-38-2
7440-57-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.000
0.007
0.039
0.001
0.003
0.008
2.617
0.005
0.031
0.675
2.433
0.133
0.010
Average
Mass
[%]
0.00
0.12
0.66
0.01
0.04
0.13
43.89
0.09
0.53
11.32
40.81
2.23
0.17
29. August 2013
5.96 mg
Sum
[%]
Average
Mass
[ppm]
12
1153
0.78
6567
88
441
1323
44.07
0.09
439021
853
5266
113219
52.66
2.23
0.17
408115
22262
1680
526600
22262
1680
1000000
440873
853
7732
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
stm32/stm8
京公网安备 11010802033920号
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