Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
2EDL05I06PJ
MA001136736
PG-DSO-14-49
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.952
0.014
0.057
1.150
46.675
0.228
0.175
9.470
78.036
1.226
0.307
0.119
0.423
Average
Mass
[%]
0.69
0.01
0.04
0.83
33.62
0.16
0.13
6.82
56.21
0.88
0.22
0.09
0.30
29. August 2013
138.83 mg
Sum
[%]
0.69
Average
Mass
[ppm]
6858
103
414
8280
34.50
0.16
336194
1644
1263
68209
63.16
0.88
0.22
562090
8832
2208
859
0.39
3046
3905
1000000
631562
8832
2208
344991
1644
Sum
[ppm]
6858
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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