Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IGB30N60T
MA000960982
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
2.481
0.304
0.091
304.026
2.697
10.311
113.424
563.683
9.657
0.228
0.001
0.073
0.058
2.789
0.165
0.548
547.666
Average
Mass
[%]
0.16
0.02
0.01
19.51
0.17
0.66
7.28
36.18
0.62
0.01
0.00
0.00
0.00
0.18
0.01
0.04
35.15
29. August 2013
1558.20 mg
Sum
[%]
0.16
Average
Mass
[ppm]
1592
195
59
19.54
0.17
195113
1731
6617
72792
44.12
0.62
361752
6197
147
0.01
0
47
37
0.18
1790
106
352
35.20
351473
351931
1000000
1874
147
441161
6197
195367
1731
Sum
[ppm]
1592
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com