Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB027N10N3 G
MA000801042
PG-TO263-3-2
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
phosphorus
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
tin
silver
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-31-5
7440-22-4
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
15.455
0.091
0.304
304.026
10.857
10.030
110.330
548.305
9.657
0.228
0.001
0.147
0.183
7.001
0.165
0.548
547.666
Average
Mass
[%]
0.99
0.01
0.02
19.43
0.69
0.64
7.05
35.03
0.62
0.01
0.00
0.01
0.01
0.45
0.01
0.04
34.99
29. August 2013
1564.99 mg
Sum
[%]
0.99
Average
Mass
[ppm]
9875
58
194
19.46
0.69
194266
6938
6409
70498
42.72
0.62
350359
6170
146
0.01
0
94
117
0.47
4474
105
350
35.04
349947
350403
1000000
4684
146
427264
6170
194519
6938
Sum
[ppm]
9875
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com