8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54
8M × 16 同步动态随机存取存储器, 5 ns, PDSO54
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Winbond(华邦电子) |
| 零件包装代码 | TSOP2 |
| 包装说明 | TSOP2, |
| 针数 | 54 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST |
| 最长访问时间 | 5 ns |
| 其他特性 | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PDSO-G54 |
| 长度 | 22.22 mm |
| 内存密度 | 134217728 bi |
| 内存集成电路类型 | SYNCHRONOUS DRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 54 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 座面最大高度 | 1.2 mm |
| 自我刷新 | YES |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| W9812G6JH-6K | W9812G6JH-6 | W9812G6JH-6A | W9812G6JH-6I | W9812G6JH-75 | W9812G6JH_13 | W9812G6JH | W9812G6JH-5 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | IC DRAM 128M PARALLEL 54TSOP |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
| 组织 | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8M × 16 | 8M × 16 | 8MX16 |
| 表面贴装 | YES | YES | YES | YES | YES | Yes | Yes | YES |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | 双 | 双 | DUAL |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - | 符合 |
| 厂商名称 | Winbond(华邦电子) | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | - | - | Winbond(华邦电子) |
| 零件包装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | - | - | TSOP2 |
| 包装说明 | TSOP2, | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | - | - | TSOP2, TSOP54,.46,32 |
| 针数 | 54 | 54 | 54 | 54 | 54 | - | - | 54 |
| Reach Compliance Code | unknow | unknow | compli | compli | compli | - | - | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | - | FOUR BANK PAGE BURST |
| 最长访问时间 | 5 ns | 5 ns | 5 ns | 5 ns | 5.4 ns | - | - | 4.5 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | - | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | - | - | R-PDSO-G54 |
| 长度 | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | - | - | 22.22 mm |
| 内存密度 | 134217728 bi | 134217728 bi | 134217728 bi | 134217728 bi | 134217728 bi | - | - | 134217728 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | - | - | SYNCHRONOUS DRAM |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | - | - | 1 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | - | - | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | - | - | 8000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS |
| 最高工作温度 | 105 °C | 70 °C | 85 °C | 85 °C | 70 °C | - | - | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | - | - | TSOP2 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | - | SMALL OUTLINE, THIN PROFILE |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - | - | 1.2 mm |
| 自我刷新 | YES | YES | YES | YES | YES | - | - | YES |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | - | - | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | CMOS |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | - | 0.8 mm |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | - | - | 10.16 mm |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 |
| 最大时钟频率 (fCLK) | - | 166 MHz | 166 MHz | 166 MHz | 133 MHz | - | - | 200 MHz |
| I/O 类型 | - | COMMON | COMMON | COMMON | COMMON | - | - | COMMON |
| 交错的突发长度 | - | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | - | - | 1,2,4,8 |
| JESD-609代码 | - | e3 | e3 | e3 | e3 | - | - | e3 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - | 3-STATE |
| 封装等效代码 | - | TSOP54,.46,32 | TSOP54,.46,32 | TSOP54,.46,32 | TSOP54,.46,32 | - | - | TSOP54,.46,32 |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | - | - | 260 |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
| 刷新周期 | - | 4096 | 4096 | 4096 | 4096 | - | - | 4096 |
| 连续突发长度 | - | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | - | - | 1,2,4,8,FP |
| 最大待机电流 | - | 0.002 A | 0.002 A | 0.002 A | 0.002 A | - | - | 0.002 A |
| 最大压摆率 | - | 0.075 mA | 0.075 mA | 0.075 mA | 0.07 mA | - | - | 0.08 mA |
| 端子面层 | - | Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | - | Matte Tin (Sn) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
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