8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54
8M × 16 同步动态随机存取存储器, 5 ns, PDSO54
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Winbond(华邦电子) |
零件包装代码 | TSOP2 |
包装说明 | TSOP2, TSOP54,.46,32 |
针数 | 54 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
访问模式 | FOUR BANK PAGE BURST |
最长访问时间 | 5 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 166 MHz |
I/O 类型 | COMMON |
交错的突发长度 | 1,2,4,8 |
JESD-30 代码 | R-PDSO-G54 |
JESD-609代码 | e3 |
长度 | 22.22 mm |
内存密度 | 134217728 bi |
内存集成电路类型 | SYNCHRONOUS DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 54 |
字数 | 8388608 words |
字数代码 | 8000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 8MX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装等效代码 | TSOP54,.46,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
认证状态 | Not Qualified |
刷新周期 | 4096 |
座面最大高度 | 1.2 mm |
自我刷新 | YES |
连续突发长度 | 1,2,4,8,FP |
最大待机电流 | 0.002 A |
最大压摆率 | 0.075 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
Base Number Matches | 1 |
W9812G6JH-6I | W9812G6JH-6 | W9812G6JH-6A | W9812G6JH-6K | W9812G6JH-75 | W9812G6JH_13 | W9812G6JH | W9812G6JH-5 | |
---|---|---|---|---|---|---|---|---|
描述 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54 | IC DRAM 128M PARALLEL 54TSOP |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
组织 | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8M × 16 | 8M × 16 | 8MX16 |
表面贴装 | YES | YES | YES | YES | YES | Yes | Yes | YES |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | 双 | 双 | DUAL |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | - | - | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - | 符合 |
厂商名称 | Winbond(华邦电子) | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | - | - | Winbond(华邦电子) |
零件包装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | - | - | TSOP2 |
包装说明 | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | TSOP2, | TSOP2, TSOP54,.46,32 | - | - | TSOP2, TSOP54,.46,32 |
针数 | 54 | 54 | 54 | 54 | 54 | - | - | 54 |
Reach Compliance Code | compli | unknow | compli | unknow | compli | - | - | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | - | FOUR BANK PAGE BURST |
最长访问时间 | 5 ns | 5 ns | 5 ns | 5 ns | 5.4 ns | - | - | 4.5 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | - | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 166 MHz | 166 MHz | 166 MHz | - | 133 MHz | - | - | 200 MHz |
I/O 类型 | COMMON | COMMON | COMMON | - | COMMON | - | - | COMMON |
交错的突发长度 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | - | 1,2,4,8 | - | - | 1,2,4,8 |
JESD-30 代码 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | - | - | R-PDSO-G54 |
JESD-609代码 | e3 | e3 | e3 | - | e3 | - | - | e3 |
长度 | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm | - | - | 22.22 mm |
内存密度 | 134217728 bi | 134217728 bi | 134217728 bi | 134217728 bi | 134217728 bi | - | - | 134217728 bit |
内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | - | - | SYNCHRONOUS DRAM |
端口数量 | 1 | 1 | 1 | 1 | 1 | - | - | 1 |
字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | - | - | 8388608 words |
字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | - | - | 8000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 85 °C | 105 °C | 70 °C | - | - | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | - | - | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
封装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | - | - | TSOP2 |
封装等效代码 | TSOP54,.46,32 | TSOP54,.46,32 | TSOP54,.46,32 | - | TSOP54,.46,32 | - | - | TSOP54,.46,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | - | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | - | 260 | - | - | 260 |
电源 | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - | - | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | - | Not Qualified |
刷新周期 | 4096 | 4096 | 4096 | - | 4096 | - | - | 4096 |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - | - | 1.2 mm |
自我刷新 | YES | YES | YES | YES | YES | - | - | YES |
连续突发长度 | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | - | 1,2,4,8,FP | - | - | 1,2,4,8,FP |
最大待机电流 | 0.002 A | 0.002 A | 0.002 A | - | 0.002 A | - | - | 0.002 A |
最大压摆率 | 0.075 mA | 0.075 mA | 0.075 mA | - | 0.07 mA | - | - | 0.08 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | - | - | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | CMOS |
端子面层 | Matte Tin (Sn) | Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | - | - | Matte Tin (Sn) |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | - | 0.8 mm |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | - | - | 10.16 mm |
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